Patents by Inventor Sam Chiang

Sam Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method
    Patent number: 6258622
    Abstract: A packaging method for integrated circuit device, which is fit to apply flip chip bonding technique to a leadframe-type chip carrier. The packaging method will not increase the difficulty in assembly of the integrated circuit chip with the leadframe and is able to ensure that the integrated circuit chip be assembled with the lead fingers of the leadframe without false soldering. Also, the packaging method can achieve less inductance of the transmission line and faster transmission speed. In addition, the cost required of the packaging method can be much lower than that for the organic or ceramic base board.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: July 10, 2001
    Assignee: Apack Technologies Inc.
    Inventors: Albert Lin, Sam Chiang, Chong-Ren Maa