Abstract: A radiation-emitting component is specified with a carrier having a cavity, a radiation-emitting semiconductor chip which is arranged on a bottom surface delimiting the cavity and which is configured to generate primary electromagnetic radiation, and a first reflector layer arranged above a top surface of the semiconductor chip, wherein the carrier is transparent in places to the primary electromagnetic radiation, and the semiconductor chip is spaced apart from at least one side surface delimiting the cavity.

Abstract: A radiation-emitting component is specified with a carrier having a cavity, a radiation-emitting semiconductor chip which is arranged on a bottom surface delimiting the cavity and which is configured to generate primary electromagnetic radiation, and a first reflector layer arranged above a top surface of the semiconductor chip, wherein the carrier is transparent in places to the primary electromagnetic radiation, and the semiconductor chip is spaced apart from at least one side surface delimiting the cavity.

Abstract: A radiation-emitting component (1) is specified with a carrier (2) having a cavity (9), a radiation-emitting semiconductor chip (3) which is arranged on a bottom surface delimiting the cavity (9) and which is configured to generate primary electromagnetic radiation, and a first reflector layer (6) arranged above a top surface of the semiconductor chip (3), wherein the carrier (2) is transparent in places to the primary electromagnetic radiation, and the semiconductor chip (3) is spaced apart from at least one side surface delimiting the cavity (9).

Abstract: A light-emitting device and a method for manufacturing a light-emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip with a light-outcoupling surface surrounded laterally by a first reflective material in a form-locking manner, a foil element on the light-outcoupling surface, an optical element on the foil element laterally surrounded by a second reflective material in a form-locking manner and a gas-filled gap located at least in a partial region between the foil element and the optical element.

Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.

Abstract: A radiation-emitting component (1) is specified with a carrier (2) having a cavity (9), a radiation-emitting semiconductor chip (3) which is arranged on a bottom surface delimiting the cavity (9) and which is configured to generate primary electromagnetic radiation, and a first reflector layer (6) arranged above a top surface of the semiconductor chip (3), wherein the carrier (2) is transparent in places to the primary electromagnetic radiation, and the semiconductor chip (3) is spaced apart from at least one side surface delimiting the cavity (9).

Abstract: A light-emitting device and a method for manufacturing a light-emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip with a light-outcoupling surface surrounded laterally by a first reflective material in a form-locking manner, a foil element on the light-outcoupling surface, an optical element on the foil element laterally surrounded by a second reflective material in a form-locking manner and a gas-filled gap located at least in a partial region between the foil element and the optical element.

Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.

Abstract: An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.

Abstract: An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.

Abstract: Disclosed is an effective programming method for non-volatile flash memory including memory cells, each formed of a select transistor and a floating transistor. The method includes imposing a positive voltage onto a control gate of the floating transistor as a word line, supplying a zero voltage to a triple well, a deep N well, and a select gate of the select transistor to turn off the select transistor, and finally providing a moderate positive voltage to a drain of the control transistor. Owing to the junction band-to-band tunneling effect, the electron of the hole-electron pair generated between the junction of the bit line and the triple well leaps to the floating gate of the floating transistor driven by the positive electric field to form a higher threshold voltage for the memory cell such that the process of programming is accomplished.

Abstract: The present invention is related to an article of footwear, namely an interactive activity integrated into the article of footwear. The interactive activity may be operated when the article of footwear is either in motion or stationary. The interactive activity instructs the user to respond. Upon a correct or incorrect response, the interactive activity will provide either further instruction or provide a signal that informs the user of the propriety of their response. The interactive activity may be a music tutorial, a game, or an educational tool.

Abstract: A chemical-mechanical polishing platform that comprises a polishing table, a wafer carrier, a polishing pad, a slurry supplier, a conditioner, and a means for cleaning the polishing pad. With respect to in-situ or ex-situ chemical-mechanical polishing, the wafer carrier, conditioner, and means for cleaning the polishing pad are adequately disposed above the polishing pad. The chemical-mechanical polishing is performed by rotation of the polishing pad; the region of the polishing pad that has polished the wafer then passes sequentially through the conditioner, the means for cleaning that removes diamond particles that may drop on the polishing pad, and through the slurry supplier that provides adequate slurry such that the polishing process can be repeated without scraping damage of the wafer. The means for cleaning of the present invention can have any shapes adapted to remove diamond particles on the polishing pad, such as circular or cylindrical brush sweeper.

Abstract: A fluid circulating system for providing a fluid into a manufacturing equipment and receiving a drained fluid from the manufacturing equipment.