Abstract: A rotary switch (102) for an electronic device (100) includes a bump stop (104) that triggers a ratcheting feature when hit. The range of the rotary switch (102) is expanded via the ratcheting feature. The ratcheting feature inhibits scrolling through a device parameter in one rotation direction and enables scrolling through the device parameter in the opposite rotation direction. Depending on which direction the bump stop (104) is hit, the parameter is either incremented or decremented. The range of the rotary switch can also be expanded by modifying the step size of the rotary switch based on the range of a selected parameter (504). The coarse step is then narrowed with each change in rotation direction (510, 518) based on current, previous and useable switch positions (512, 514).

Abstract: A unique photoresist process is provided which achieves clean and complete lift-off of a thin film layer such as a sputtered thin film formed on a photoresist which is formed above a semiconductor substrate. The process of the present invention relies on a reentrant photoresist profile which breaks the continuity of the thin film layer. Accordingly, the process of the present invention ensures a clean lift-off. The desired photoresist profile which breaks the continuity of the thin film layer can be obtained by a typical photoresist process preceded by an oxidation process that takes place on the surface of the semiconductor substrate. The oxidation process provides a thin native oxide layer with thickness ranging from about 30 to 50 .ANG.. No extra processing steps involving dielectric film deposition and etch are required to achieve clean lift-off. Nevertheless, the process of the present invention ensures the clean lift-off of the thin film layer.

Abstract: A method of fabricating a bubble domain device composite structure on a substrate of depositing a barrier layer of a suitable polymeric dielectric material on the substrate; subsequently depositing a layer of electrically conductive material thereover; subsequently depositing a spacer layer of a liquid polymeric dielectric material over the conductive layer; processing the spacer layer so that the surface of the spacer layer is substantially planar; and subsequently depositing a layer of a magnetically operative material over the spacer layer.