Patents by Inventor Sam E. Wuest

Sam E. Wuest has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10857754
    Abstract: A peelable package is described. The package comprises a first sealant layer comprising low density polyethylene and a first contaminant and a second sealant layer comprising polyethylene polymer, such as high-density polyethylene, low density polyethylene, ethylene alpha-olefin copolymer or blends of such, and a second contaminant. The first contaminant and the second contaminant are selected from the group consisting propylene/ethylene copolymer with ethylene content from about 0.1 mol % to about 5 mol %, polypropylene homopolymer, butene/ethylene copolymer and polybutene homopolymer. The first contaminant of the first sealant layer may be the same as or different than the second contaminant of the second sealant layer. Also described are various embodiments of the first sealant layer, the second sealant layer and the peelable seal that is formed between the first sealant layer and the second sealant layer.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: December 8, 2020
    Assignee: Bemis Company, Inc.
    Inventors: Kevin D. Glaser, Sam E. Wuest
  • Patent number: 10780683
    Abstract: The present invention is directed to a fracturable thermoformable packaging sheet comprising at least one thermoplastic layer having a thickness of between 10 mil and 50 mil which is composed of a polymer matrix of between 35% (wt.) to 77.5% (wt.) relative to the total weight of the thermoplastic layer of a substantially amorphous aromatic polyester. Incorporated into this polymer matrix of the at least one thermoplastic layer is an inorganic filler which is present in an amount of between 22% (wt.) to 50% (wt.) relative to the total weight of the thermoplastic layer. The inorganic filler is encased in a carrier resin which is present in an amount of between 0.5% (wt.) to 15% (wt.) relative to the total weight of the thermoplastic layer.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: September 22, 2020
    Assignee: Bemis Company, Inc.
    Inventors: Zheng Tian, Ross K. Gruetzmacher, Sam E. Wuest
  • Publication number: 20200039174
    Abstract: A peelable package is described. The package comprises a first sealant layer comprising low density polyethylene and a first contaminant and a second sealant layer comprising polyethylene polymer, such as high-density polyethylene, low density polyethylene, ethylene alpha-olefin copolymer or blends of such, and a second contaminant. The first contaminant and the second contaminant are selected from the group consisting propylene/ethylene copolymer with ethylene content from about 0.1 mol % to about 5 mol %, polypropylene homopolymer, butene/ethylene copolymer and polybutene homopolymer. The first contaminant of the first sealant layer may be the same as or different than the second contaminant of the second sealant layer. Also described are various embodiments of the first sealant layer, the second sealant layer and the peelable seal that is formed between the first sealant layer and the second sealant layer.
    Type: Application
    Filed: September 5, 2019
    Publication date: February 6, 2020
    Inventors: Kevin D. Glaser, Sam E. Wuest
  • Publication number: 20180311945
    Abstract: The present invention is directed to a fracturable thermoformable packaging sheet comprising at least one thermoplastic layer having a thickness of between 10 mil and 50 mil which is composed of a polymer matrix of between 35% (wt.) to 77.5% (wt.) relative to the total weight of the thermoplastic layer of a substantially amorphous aromatic polyester. Incorporated into this polymer matrix of the at least one thermoplastic layer is an inorganic filler which is present in an amount of between 22% (wt.) to 50% (wt.) relative to the total weight of the thermoplastic layer. The inorganic filler is encased in a carrier resin which is present in an amount of between 0.5% (wt.) to 15% (wt.) relative to the total weight of the thermoplastic layer.
    Type: Application
    Filed: June 12, 2015
    Publication date: November 1, 2018
    Inventors: Zheng Tian, Ross K. Gruetzmacher, Sam E. Wuest