Abstract: A method of brokering information in a manufacturing system which includes a broker coupled between a supplier of information and a consumer of information. The manufacturing system receives information from the supplier in a first format and sends information from the broker to the consumer in a second format.

Abstract: In one example, the method includes operating a process tool that has a plurality of sensors for sensing at least one parameter associated with the operation of the process tool, obtaining data from the sensors and determining at least one maintenance activity for the process tool based upon the data obtained from the sensors. In another example, data from the sensors is provided to a controller that analyzes the data and indicates desired variations in at least one maintenance activity to be performed on the process tool based upon the analysis of the data. In yet another example, the controller identifies a plurality of maintenance activities to be performed on the process tool based upon the analysis of the data.

Abstract: A method and apparatus is provided for routing workpieces based upon detecting a fault. The method comprises routing a workpiece to a first processing tool identified by a dispatch system, detecting a fault condition associated with the first processing tool and notifying the dispatch system of the detected fault condition. The method further comprises routing a second workpiece to a second processing tool in response to the dispatch system being notified of the fault condition.

Abstract: A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.

Abstract: The present invention relates to an equipment interface which obtains data communicated between a tool, such as a semiconductor manufacturing tool, and its host computer system in real-time via a point-to-point connection. The equipment interface distributes the data automatically and continually to other remote application programs without the need for hardware to be added to the tool or to the host computer system.

Abstract: A method and apparatus for determining a possible cause of a fault in a semiconductor fabrication process. The method includes determining a first fault in a first processing tool executing under first operating conditions and determining a second fault in a second processing tool executing under second operating conditions. The method further includes identifying a possible source of the second fault based on at least the first operating conditions of the first processing tool.

Abstract: The present invention is generally directed to method of dynamically enabling additional sensors based upon initial sensor data, and a system for accomplishing same. In one illustrative embodiment, the method comprises initiating a process operation in a process tool, determining if an abnormal process event has occurred in the process operation based upon data sensed by at least one control sensor, enabling at least one additional sensor to acquire additional data related to the process operation if an abnormal process event is determined to have occurred and obtaining data from the enabled additional sensor.

Abstract: Wafer processing cycle times are substantially reduced by predicting and correcting downstream processing location anomalies before a wafer lot is released to the next processing location on the processing line. In an example embodiment, a method of verifying downstream processing line readiness in a semiconductor processing facility having a material handling system includes presenting a wafer lot to a first application processing location. A signal is then sent to a second application processing location to verify readiness by simulating the second application processing on the wafer lot. The availability or operating status of the second processing location is then communicated to the material handling system, the material handling system communicating instructions to the first processing location on where to send the wafer lot after the processing simulation is complete. The readiness verification method is repeated until the wafer lot is completely processed.

Abstract: A method and apparatus is provided for operating a processing tool in a degraded mode upon detecting a fault and in accordance with one or more business rules. The method comprises detecting a fault associated with a processing tool capable of processing one or more workpieces and operating the processing tool in a degraded mode in response to detecting the fault.

Abstract: A method, apparatus, and system is provided for a proactive dispatch system to improve line balancing. At least one request for processing a semiconductor wafer is received. A line-balancing analysis based upon the request is performed. At least one semiconductor wafer based upon the line-balancing analysis is processed.

Abstract: A system for identifying wafers contained in a wafer carrier includes a wafer sorter. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The wafer sorter is adapted to scan at least a portion of a wafer extending from the carrier and to identify at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier. A method for identifying wafers contained in a wafer carrier is provided. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The method includes scanning at least a portion of a wafer extending from the carrier and identifying at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier.

Abstract: The detection of a processing deviation in a cluster tool of a wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the cluster tool. In an example embodiment, a wafer is placed into a first chamber of the cluster tool and it is rotated to a certain angle of rotation. Each time the wafer moves within the cluster tool the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The wafer exits the cluster tool and is examined for structural or surface defects that indicate that there was a variation in the processing parameters. A wafer movement map is developed from the positional coordinates and the map is then used as an analysis tool to identify the processing location that caused defect to occur. An important advantage is the increased control and traceability that the tracking method brings to single wafer handling and processing.

Abstract: The present invention is generally directed to various methods for determining, tracking and/or controlling processing based upon wafer characteristics. In one embodiment, the method is directed to selecting a plurality of wafers from the group of wafers based upon the semiconductor device to be manufactured on the wafer and at least one characteristic of the wafers. In another embodiment, the method comprises identifying a source of wafers wherein the device metrology data lies outside of the preselected range based upon the wafer identification mark and the device metrology data. As yet another example, the method comprises determining at least one parameter of a process operation to be performed on a wafer in a processing tool based upon the determined wafer characteristics.

Abstract: The detection of a processing deviation in a multiple stage wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the wafer processing system. In an example embodiment, a wafer is placed into a first processing stage and it is rotated to a certain angle of rotation. As the wafer moves from one processing stage to another the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The processed wafer is examined for surface deviations arising from variations in the processing parameters. The positional coordinates are used to develop a wafer movement map that aids in identifying the processing stage location where the deviation in the processing parameters occurred. An important advantage is the increased processing deviation traceability that the method brings to wafer processing.

Abstract: The movement of individual wafers in a semiconductor facility is tracked via a set of coordinates that include rotational points of reference on the wafer that coincide with the wafer's location in the processing line. In an example embodiment, the method includes imparting angles of rotation on the wafers in different stages of the processing system. The different angles of rotation on each wafer are collected as data along with the wafer location in the processing system and the tool/equipment identification code. The combined angle of rotation and wafer location data is used to map the path the wafer has traveled from the onset of processing. An important advantage of the invention is the increased control and traceability that the invention brings to wafer processing.

Abstract: Wafer processing time and handling is reduced by coupling a retrofitable processing tool between two standard processing tools. In an example embodiment, the retrofitable tool includes a metrology unit, which is coupled between two processing tools, that provides metrology capability without having to remove the wafers from the processing line. Once the metrology process is complete the wafers are transferred to the next processing tool and the retrofitable tool is decoupled from the two processing tools. An important advantage is the increased processing flexibility that the processing line reconfiguration method and the retrofitable tool bring to wafer processing.