Abstract: Disclosed is a pretreatment method for utilization of coal pond ash (coal ash buried in ash ponds near coal-fired power plants), and more specifically a treatment method of coal pond ash capable of utilizing coal ash with high efficiency through simple separation processes including screening, float-sink, flotation, grinding, and magnetic separation.

Abstract: A semiconductor package comprises a first redistribution layer including a first conductive pattern; a connection module on an upper surface of the first redistribution layer; a glass core extending around the connection module on the upper surface of the first redistribution layer; a through via extended in the glass core; a second insulating layer on the glass core, wherein a portion of the second insulating layer is in the through via; a second redistribution layer on an upper surface of the glass core, wherein the second redistribution layer includes a via pad; and a first semiconductor chip and a second semiconductor chip space apart from each other on an upper surface of the second redistribution layer, wherein the via pad is in contact with the through via, and wherein the first semiconductor chip and the second semiconductor chip are electrically connected to each other through the connection module.

Abstract: A heat converter according to one embodiment of the present invention comprises: a plurality of unit modules respectively arranged in a first direction and a second direction that intersects the first direction; and a frame, which supports the plurality of unit modules, allows cooling water to flow in through one surface arranged in the first direction, and allows the cooling water to be discharged through the other surface arranged in the first direction, wherein each unit module includes: a cooling water passage chamber having first and second surfaces arranged to be spaced in the first direction, third and fourth surfaces arranged to be spaced in a third direction that intersects the first direction and the second direction, a fifth surface arranged to be spaced in the second direction such that cooing water flows therein, and a sixth surface from which cooling water is discharged; a first thermoelectric module arranged on the first surface; and a second thermoelectric module arranged on the second surface

Abstract: A laminate useful as cell-to-cell battery insulation, the laminate having an insulating area and a periphery seal area, the insulating area comprising, in order: a first outer layer of paper comprising aramid material and mica; an inner layer comprising a felt or paper of inorganic short fibers; and a second outer layer of paper comprising aramid material and mica; the periphery seal area being void of the inner layer and being formed by adhering the first and second outer layers of paper to one another; wherein the periphery seal area extends around the periphery of the insulating area.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.

Abstract: A semiconductor package includes a package substrate, an organic interposer on the package substrate, the organic interposer including a plurality of organic insulating layers including an organic compound, at least two semiconductor chips on the organic interposer, and a mold, on an upper surface of the organic interposer, surrounding the at least two semiconductor chips.

Abstract: The present invention provides a novel compound that can improve the luminous efficiency, stability and life span of the element, an organic electronic element using the same, and an electronic device thereof.

Abstract: A fan-out semiconductor package including a first redistribution layer; a first semiconductor chip on the first redistribution layer; an interconnector on the first redistribution layer and spaced apart from the first semiconductor chip; a molded layer covering the interconnector and side surfaces of the first semiconductor chip; and a second redistribution layer on the molded layer, wherein the interconnector includes a metal ball and is electrically connected to the first redistribution layer, the second redistribution layer includes a first line wiring, and a first via electrically connected to the first line wiring, the first via is connected to the interconnector, and a part of the first via is in the molded layer.

Abstract: A method includes forming a first package structure including a first connection member including a first redistribution layer, a first frame having a first through-portion, a first semiconductor chip having a connection pad electrically connected to the first redistribution layer, and a first encapsulant covering a portion of each of the first frame and the first semiconductor chip, forming a second package structure including a second connection member including a second redistribution layer, a second semiconductor chip having a second connection pad, and a second encapsulant covering a portion of the second semiconductor chip, forming a first through-via, the first through-via electrically connecting to the second redistribution layer, and laminating the first package structure on the second package structure.

Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.

Abstract: A semiconductor package including a core structure, in which a first and second semiconductor chips and passive components are embedded, a connection structure disposed on a first side of the core structure, and including a redistribution layer electrically connected to the first and second semiconductor chips and the passive components, and a metal pattern layer and a backside wiring layer disposed on a second side of the core structure opposing the first side, and spaced apart from each other. The core structure includes a first metal layer surrounding the first semiconductor chip, a second metal layer surrounding the first semiconductor chip, and the first metal layer, a third metal layer surrounding the second semiconductor chip, and a fourth metal layer surrounding the second semiconductor chip, the passive components, and the third metal layer, and each of the first to fourth metal layers is electrically connected to the metal pattern layer.

Abstract: Disclosed are a subframe for a vehicle part having the high strength and high elongation by including the high iron content and an aluminum alloy composition with increased content of iron (Fe). The aluminum alloy composition includes an amount of about 0.15 to 0.25 wt % of iron (Fe), an amount of about 0.2 to 0.25 wt % of manganese (Mn), an amount of about 0.15 to 0.25 wt % of magnesium (Mg), an amount of about 7.5 to 9.0 wt % of silicon (Si), and an amount of about 0.5 wt % or less of inevitable impurities, and a balance of aluminum (Al), and all the wt % are based on the total weight of the aluminum alloy composition.

Abstract: A method including forming a frame having an opening, forming a first metal layer, forming a first encapsulant, forming an insulation layer on the first metal layer, forming a first through-hole and a second through-hole penetrating the insulation layer and the first encapsulant, forming a second metal layer and a third metal layer, forming a second encapsulant, forming a first metal via and a second metal via penetrating the second encapsulant and a metal pattern layer on the second encapsulant, and forming a connection structure. The first metal layer and the second metal layer respectively are formed to extend to a surface of each of the first encapsulant and the frame, facing the metal pattern layer, and the first metal layer and the second metal layer are connected to the metal pattern layer through the first metal via and the second metal via having heights different from each other.

Abstract: A semiconductor package is provided. The semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a heat sink structure comprising a lower heat sink pattern disposed on the first semiconductor chip, a metal film pattern disposed on the lower heat sink pattern, and an insulating film disposed on side walls of the lower heat sink pattern and side walls of the metal film pattern, an interposer disposed on the heat sink structure, and a solder ball which connects the heat sink structure and the interposer.

Abstract: A nonwoven sheet material comprising a substrate and an applied fibril covering on said substrate, and process for making same, wherein the substrate is a paper, a spunbonded fibrous sheet, or a fibrous or non-fibrous membrane, and wherein the applied fibril covering comprises fibrils having a diameter of 1 to 5000 nanometers, a length of 0.2 to 3 millimeters, a specific surface area of 3 to 40 square meters/gram, and a Canadian Standard Freeness of 0 to 10 milliliters, the fibrils comprising an aramid polymer.

Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.

Abstract: A paper suitable for use in a battery or battery pack as a flame barrier or thermal insulation, the paper comprising 60 to 95 weight percent aerogel powder and 5 to 40 weight aramid polymer fibrils; the paper having a thickness of 50 to 4000 micrometers.

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.

Abstract: A paper suitable for use as a cell-to-cell flame barrier in a battery, and a battery comprising the paper, the paper comprising 40 to 70 weight percent fibrids and 30 to 60 weight percent mica, based on the total weight of the fibrids and mica in the paper; wherein the fibrids comprise a blend of 80 to 20 weight percent polymer and 20 to 80 weight percent aerogel powder, based on the total weight of the polymer and aerogel powder in the fibrids; the paper having a thickness of 100 to 4000 micrometers.

Abstract: A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.