Patents by Inventor Sam Kao
Sam Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170167028Abstract: Methods and systems are disclosed for processing a precursor material. The method includes introducing a substrate having a precursor material deposited on a surface of the substrate into a first zone of a vacuum chamber. The precursor material comprises copper, indium, and at least one of gallium, selenium, sulfur, sodium, antimony, boron, aluminum, and silver. The method further includes, within the first zone, heating the precursor material to a target reaction temperature within a range of about 270° C. to about 490° C. The method further includes maintaining a selenium vapor in a second zone of the vacuum chamber, and after heating the precursor material to the target reaction temperature, introducing the precursor material and the substrate to the second zone of the vacuum chamber.Type: ApplicationFiled: June 8, 2015Publication date: June 15, 2017Inventors: Arthur C. WALL, John Kwangyong KIM, Eugene BYKOV, Sam KAO, Qiongzhong JIANG, Bruce D. HACHTMANN
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Publication number: 20160273097Abstract: Methods and systems are disclosed for monitoring vapor in a vacuum reactor apparatus. An system has (a) a vacuum chamber, (b) a vapor source housed in the vacuum chamber, wherein the vapor source is configured to generate a vapor, (c) a reaction vessel housed in the vacuum chamber and coupled to the vapor source, where the reaction vessel has an outlet to the vacuum chamber, and where the reaction vessel is configured to receive the vapor from the vapor source and to emit a portion of the received vapor into the vacuum chamber through the outlet, and (d) one or more sensors housed in the vacuum chamber, where the one or more sensors are configured to detect the vapor emitted through the outlet.Type: ApplicationFiled: October 16, 2014Publication date: September 22, 2016Applicant: NUVOSUN, INC.Inventors: Arthur C. WALL, Sam KAO, John Kwangyong KIM, Bruce D. HACHTMANN, Qiongzhong JIANG, Karnig Ross Baron PORTER
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Patent number: 8603575Abstract: A thin-film absorber formation method includes: operating a furnace having an internal atmosphere containing a process gas; loading process gas material into a source container that is part of a system configured to provide process gas to the furnace, wherein loading of the source container occurs without exposing the internal atmosphere of the furnace to external atmosphere present in the source container by solidifying process gas material to form a gas tight seal to separate the source container from the furnace, wherein the seal is formed before the source container is opened for loading and external atmosphere enters the source container, including a pathway configured to retain process gas material in a section of the pathway to solidify and create the seal.Type: GrantFiled: October 6, 2011Date of Patent: December 10, 2013Assignee: Nanosolar, Inc.Inventor: Sam Kao
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Patent number: 8525152Abstract: Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.Type: GrantFiled: June 7, 2010Date of Patent: September 3, 2013Assignee: Nanosolar, Inc.Inventors: Craig Leidholm, Brent Bollman, James R. Sheats, Sam Kao, Martin R. Roscheisen
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Patent number: 8309949Abstract: Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.Type: GrantFiled: November 22, 2010Date of Patent: November 13, 2012Assignee: Nanosolar, Inc.Inventors: James R. Sheats, Sam Kao, Martin R. Roscheisen
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Publication number: 20120237816Abstract: A bipolar battery may include a substrate having a matrix made of a thermoset polymer formed from a liquid precursor. One or more conductive pellets can be disposed in the matrix to provide electrical connection between opposite sides of the matrix. Each conductive pellet has a characteristic thickness that is greater than a thickness of the matrix. Each of the one or more conductive pellets protrudes beyond first and second surfaces of the matrix.Type: ApplicationFiled: March 15, 2011Publication date: September 20, 2012Applicant: YottaQ, Inc.Inventors: Martin R. Roscheisen, Brent J. Bollman, Hak Fei Poon, Zhengyu Wu, Boris Monahov, Sam Kao
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Patent number: 8198117Abstract: Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.Type: GrantFiled: August 16, 2006Date of Patent: June 12, 2012Assignee: Nanosolar, Inc.Inventors: Craig R. Leidholm, Brent Bollman, James R. Sheats, Sam Kao, Martin R. Roscheisen
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Publication number: 20120052613Abstract: Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.Type: ApplicationFiled: June 27, 2011Publication date: March 1, 2012Inventors: James R. Sheats, Sam Kao, Martin R. Roscheisen
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Patent number: 7968869Abstract: Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.Type: GrantFiled: October 4, 2008Date of Patent: June 28, 2011Assignee: Nanosolar, Inc.Inventors: James R. Sheats, Sam Kao, Martin R. Roscheisen
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Publication number: 20110121353Abstract: Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.Type: ApplicationFiled: November 22, 2010Publication date: May 26, 2011Inventors: James R. Sheats, Sam Kao, Martin R. Roscheisen
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Patent number: 7919337Abstract: Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.Type: GrantFiled: October 31, 2007Date of Patent: April 5, 2011Assignee: Nanosolar, Inc.Inventors: James R. Sheats, Sam Kao, Martin R. Roscheisen
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Patent number: 7838868Abstract: Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.Type: GrantFiled: August 16, 2005Date of Patent: November 23, 2010Assignee: Nanosolar, Inc.Inventors: James R. Sheats, Sam Kao, Martin R. Roscheisen
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Publication number: 20100243049Abstract: Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.Type: ApplicationFiled: June 7, 2010Publication date: September 30, 2010Inventors: Craig Leidholm, Brent Bollman, James R. Sheats, Sam Kao, Martin R. Roscheisen
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Patent number: 7732232Abstract: Series interconnection of optoelectronic device modules is disclosed. Each device module includes an active layer disposed between a bottom electrode and a transparent conducting layer. An insulating layer is disposed between the bottom electrode of a first device module and a backside top electrode of the first device module. One or more vias are formed through the active layer, transparent conducting layer and insulating layer of the first device module. Sidewalls of the vias are coated with an insulating material such that a channel is formed through the insulating material to the backside top electrode of the first device module. The channel is at least partially filled with an electrically conductive material to form a plug that makes electrical contact between the transparent conducting layer and the backside top electrode of the first device module.Type: GrantFiled: October 1, 2007Date of Patent: June 8, 2010Assignee: Nanosolar, Inc.Inventors: James R. Sheats, Sam Kao, Gregory A. Miller, Martin R. Roscheisen
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Patent number: 7732229Abstract: Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.Type: GrantFiled: June 28, 2006Date of Patent: June 8, 2010Assignee: Nanosolar, Inc.Inventors: Craig Leidholm, Brent Bollman, James R. Sheats, Sam Kao, Martin R. Roscheisen
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Publication number: 20090178706Abstract: Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.Type: ApplicationFiled: October 4, 2008Publication date: July 16, 2009Inventors: James R. Sheats, Sam Kao, Martin R. Roscheisen
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Patent number: 7521360Abstract: A through hole (114) is formed in a wafer (104) comprising a semiconductor substrate (110). A seed layer (610) is sputtered on the bottom surface of the wafer. The seed is not deposited over the through hole's sidewalls adjacent the top surface of the wafer. A conductor (810) is electroplated into the through hole. In another embodiment, a seed is deposited into an opening in a wafer through a dry film resist mask (1110). The dry film resist overhangs the edges of the opening, so the seed is not deposited over the opening's sidewalls adjacent the top surface of the wafer. In another embodiment, a dielectric (120) is formed in an opening in a semiconductor substrate (110) by a non-conformal physical vapor deposition (PVD) process that deposits the dielectric on the sidewalls but not the bottom of the opening. A seed (610) is formed on the bottom by electroless plating. A conductor (810) is electroplated on the seed.Type: GrantFiled: October 10, 2006Date of Patent: April 21, 2009Assignee: Tru-Si Technologies, Inc.Inventors: Patrick A. Halahan, Sam Kao, Bosco Lan, Sergey Savastiouk, Oleg Siniaguine
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Publication number: 20080308148Abstract: Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.Type: ApplicationFiled: August 16, 2006Publication date: December 18, 2008Inventors: Craig R. Leidholm, Brent Bollman, James R. Sheats, Sam Kao, Martin R. Roscheisen
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Publication number: 20080142073Abstract: Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.Type: ApplicationFiled: October 31, 2007Publication date: June 19, 2008Inventors: James R. Sheats, Sam Kao, Martin R. Roscheisen
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Publication number: 20080020503Abstract: Series interconnection of optoelectronic device modules is disclosed. Each device module includes an active layer disposed between a bottom electrode and a transparent conducting layer. An insulating layer is disposed between the bottom electrode of a first device module and a backside top electrode of the first device module. One or more vias are formed through the active layer, transparent conducting layer and insulating layer of the first device module. Sidewalls of the vias are coated with an insulating material such that a channel is formed through the insulating material to the backside top electrode of the first device module. The channel is at least partially filled with an electrically conductive material to form a plug that makes electrical contact between the transparent conducting layer and the backside top electrode of the first device module.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Inventors: James Sheats, Sam Kao, Gregory Miller, Martin Roscheisen