Patents by Inventor Sam Khalili

Sam Khalili has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260133288
    Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.
    Type: Application
    Filed: January 8, 2026
    Publication date: May 14, 2026
    Applicant: Intel Corporation
    Inventors: Guiyun Bai, Sushrutha Gujjula, Ronald L. Spreitzer, Naresh Satyan, David Mathine, Sam Khalili, Sanjeev Gupta, Eleanor Patricia Paras Rabadam, Ankur Agrawal, Kenneth Brown, Jonathan Doylend, Daniel Grodensky, Israel Petronius
  • Patent number: 12481035
    Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: November 25, 2025
    Assignee: Intel Corporation
    Inventors: Eleanor Patricia Paras Rabadam, Guiyun Bai, Israel Petronius, Sushrutha Gujjula, Ronald L. Spreitzer, Kenneth Brown, Konstantin Matyuch, Boping Xie, Stephen Keele, Qifeng Wu, Ankur Agrawal, Jonathan Doylend, Sanjeev Gupta, Sam Khalili, Daniel Grodensky, Nan Kong Ng, Ron Friedman, Gal Dvoretzki
  • Publication number: 20220404474
    Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.
    Type: Application
    Filed: December 21, 2021
    Publication date: December 22, 2022
    Inventors: Eleanor Patricia Paras Rabadam, Guiyun Bai, Israel Petronius, Sushrutha Gujjula, Ronald L. Spreitzer, Kenneth Brown, Konstantin Matyuch, Boping Xie, Stephen Keele, Qifeng Wu, Ankur Agrawal, Jonathan Doylend, Sanjeev Gupta, Sam Khalili, Daniel Grodensky, Nan Kong Ng, Ron Friedman, Gal Dvoretzki
  • Publication number: 20220390562
    Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.
    Type: Application
    Filed: December 21, 2021
    Publication date: December 8, 2022
    Inventors: Guiyun Bai, Sushrutha Gujjula, Ronald L. Spreitzer, Naresh Satyan, David Mathine, Sam Khalili, Sanjeev Gupta, Eleanor Patricia Paras Rabadam, Ankur Agrawal, Kenneth Brown, Jonathan Doylend, Daniel Grodensky, Israel Petronius