Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.

Abstract: A method is disclosed for improved operation of a data storage device such as a hard disk drive, wherein the overhead for data rewriting is reduced or eliminated by the grouping of logical zones in proximity to other zones with similar writing frequencies. Thus cold zones are written near other cold zones, and hot zones near other hot zones, within a multiplicity of realms on the data storage surface. Substantial reductions in FTI writes are achievable in comparison with previous FTI mitigation algorithms.