Patents by Inventor Sam Lai
Sam Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12569012Abstract: An aerosol delivery system comprising an airflow sensor in a sensor chamber defined by one or more chamber walls and a deformable membrane attached to at least one of the one or more chamber walls, wherein the membrane is attached to the one or more chamber walls over more than half of its surface area.Type: GrantFiled: May 21, 2021Date of Patent: March 10, 2026Assignee: Nicoventures Trading LimitedInventors: Sam Lai, Ping Chou Chen, Tom Woodman
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Publication number: 20260007167Abstract: A delivery device is disclosed and includes a housing and a sound generator in the housing configured to provide an audible indication to a user relating to a function of the delivery device. The delivery device also includes a vent opening in the housing. The sound generator is positioned relative to the vent opening such that the vent opening acts as an acoustic channel to enhance the sound transmitted from the housing. A delivery system including the delivery device and a substrate aerosolizing module including a heater and a consumable having an aerosolizable substrate is also disclosed. The substrate aerosolizing aerosolising module is configured to aerosolize the substrate in response to activation of the delivery device.Type: ApplicationFiled: May 3, 2023Publication date: January 8, 2026Inventors: Ping Chou CHEN, Sam LAI
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Patent number: 12484638Abstract: A metal housing for an aerosol provision device is described and can include a printed circuit board mounted within the metal housing; a first contact spring providing an electrical connection between a first connection point on an inside of the metal housing and a ground connection of the printed circuit board; and a second contact spring providing an electrical connection between a second connection point on the inside surface of the metal housing and an antenna signal output for providing an antenna signal for transmission by the metal housing. The metal housing includes a radiating conductor element extending from a first surface element to a second surface element, wherein the first and second connection points are provided on the radiating conductor element and wherein a distance between the first and second surface elements is at least one quarter of a wavelength of the antenna signal transmission.Type: GrantFiled: May 27, 2021Date of Patent: December 2, 2025Assignee: NICOVENTURES TRADING LIMITEDInventors: Sam Lai, Rick Yang, Hsi Kai Hung, Chin Ting Huang
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Patent number: 12456664Abstract: A method of manufacturing a semiconductor device is provided. The method includes attaching a first die pad of a semiconductor die to a central pad of a package leadframe. The first die pad is located in a central region on an active side of the semiconductor die. A second die pad of the semiconductor die is connected a lead of the package lead frame. The second die pad is located in a periphery region on the active side of the semiconductor die. An encapsulant encapsulates a portion of the semiconductor die and a portion of the package leadframe. A backside surface of the semiconductor die is exposed at a top major surface of the encapsulant, and a backside surface of the central pad exposed at a bottom major surface of the encapsulant.Type: GrantFiled: October 19, 2022Date of Patent: October 28, 2025Assignee: NXP B.V.Inventors: Frank.zy Guo, Yi-Tien Liao, Sam Lai
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Publication number: 20250318576Abstract: A delivery device is disclosed and includes an elongate housing; a battery received in the housing; an end cap attached to and closing an end of the housing; and a vent opening in the end cap in fluid communication with the battery. A delivery system including the delivery device and a substrate aerosolizing module including a heater and a consumable having an aerosolizable substrate is also disclosed. The substrate aerosolizing module is configured to aerosolize the substrate in response to activation of the delivery device. Also disclosed is an end cap attachable to an end of a housing of the delivery device, and a delivery device and an accessory for charging the delivery device.Type: ApplicationFiled: May 3, 2023Publication date: October 16, 2025Inventors: Ping Chou CHEN, Sam LAI
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Publication number: 20250151783Abstract: A case for an aerosol delivery device is described. The case comprises a lid, an accelerometer (for detecting movement indicative of the lid position changing from a closed position to an open position), a battery status indicator, and a controller. The controller is configured to activate the battery status indicator when said signal indicates that the lid position has changed from the closed position to the open position.Type: ApplicationFiled: February 10, 2023Publication date: May 15, 2025Inventors: Sam LAI, Tomi VINTOLA, Rick YANG
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Publication number: 20240407469Abstract: A housing for an aerosol provision device is described comprising: a circuit board mounted within the housing; a radiating conductor element at least partially enclosing the circuit board; and an electrical connection between a first connection point on an inside of the radiating conductor element and an antenna signal output of the circuit board for providing an antenna signal for transmission such that, in use, the housing operates as an antenna.Type: ApplicationFiled: September 29, 2022Publication date: December 12, 2024Inventors: Sam LAI, Chin Ting HUANG, Hsi Kai HUNG, Mardin HSIEH, Blue LIU, Kyo KO
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Publication number: 20240234258Abstract: A method of manufacturing a semiconductor device is provided. The method includes attaching a first die pad of a semiconductor die to a central pad of a package leadframe. The first die pad is located in a central region on an active side of the semiconductor die. A second die pad of the semiconductor die is connected a lead of the package lead frame. The second die pad is located in a periphery region on the active side of the semiconductor die. An encapsulant encapsulates a portion of the semiconductor die and a portion of the package leadframe. A backside surface of the semiconductor die is exposed at a top major surface of the encapsulant, and a backside surface of the central pad exposed at a bottom major surface of the encapsulant.Type: ApplicationFiled: October 19, 2022Publication date: July 11, 2024Inventors: Frank.zy Guo, Yi-Tien Liao, Sam Lai
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Publication number: 20240180261Abstract: A charging case for an aerosol delivery system includes one or more formations that are configured to space at least a portion of the aerosol provision system from the charging case to provide an air gap. A kit of parts can include a charging case and an aerosol delivery system.Type: ApplicationFiled: May 25, 2022Publication date: June 6, 2024Inventors: Sam LAI, Ping Chou CHEN, Mohsin MASIH-UD-DIN
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Publication number: 20240180262Abstract: A charging case for an aerosol provision system includes a charging connector and a ramp. The charging connector is configured to removably connect to a component of the aerosol provision system. The ramp is arranged such that when the component is moved in a direction away from the charging connector a part of the aerosol provision system moves along the ramp. A charging case for an aerosol provision system including a charging connector and a recess. The charging connector is configured to removably connect to a component of the aerosol provision system and the recess is arranged such that when the component has been disconnected from the charging connector a portion of the component can enter the recess to allow the component to rotate relative to the charging case. A kit of parts can include a charging case and an aerosol delivery system.Type: ApplicationFiled: May 25, 2022Publication date: June 6, 2024Inventors: Sam LAI, Ping Chou CHEN, Mohsin MASIH-UD-DIN
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Publication number: 20240136256Abstract: A method of manufacturing a semiconductor device is provided. The method includes attaching a first die pad of a semiconductor die to a central pad of a package leadframe. The first die pad is located in a central region on an active side of the semiconductor die. A second die pad of the semiconductor die is connected a lead of the package lead frame. The second die pad is located in a periphery region on the active side of the semiconductor die. An encapsulant encapsulates a portion of the semiconductor die and a portion of the package leadframe. A backside surface of the semiconductor die is exposed at a top major surface of the encapsulant, and a backside surface of the central pad exposed at a bottom major surface of the encapsulant.Type: ApplicationFiled: October 18, 2022Publication date: April 25, 2024Inventors: Frank.zy Guo, Yi-Tien Liao, Sam Lai
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Publication number: 20240023602Abstract: A case for an aerosol delivery device, and a method for using the case, is described and can include a lid having an open position and a closed position; a magnet and hall sensor pair configured to provide a signal indicative of whether the lid is in the open position or the closed position; and a controller configured to receive a signal from the hall sensor indicative of whether the lid is open or closed.Type: ApplicationFiled: December 13, 2021Publication date: January 25, 2024Inventors: Sam LAI, Tomi VINTOLA
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Patent number: 11815359Abstract: A travel service system makes it possible for a driver to pick up a passenger quickly and accurately. The system obtains map information including real-scene picture information, determines a geographic coordinate, obtains a real-scene picture of the geographic coordinate, and analyzes the real-scene picture to identify a salient object in the real-scene picture. A preferable target position is determined on the basis of the identified salient object. The identified salient object and the preferable target position on the real-scene picture are marked. The real-scene picture with the marked salient object and the preferable marked target position are sent to a receiving terminal.Type: GrantFiled: July 17, 2019Date of Patent: November 14, 2023Assignee: Bayerische Motoren Werke AktiengesellschaftInventors: Sam Lai, Andy Liao
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Publication number: 20230200455Abstract: A metal housing for an aerosol provision device is described and can include a printed circuit board mounted within the metal housing; a first contact spring providing an electrical connection between a first connection point on an inside of the metal housing and a ground connection of the printed circuit board; and a second contact spring providing an electrical connection between a second connection point on the inside surface of the metal housing and an antenna signal output for providing an antenna signal for transmission by the metal housing. The metal housing includes a radiating conductor element extending from a first surface element to a second surface element, wherein the first and second connection points are provided on the radiating conductor element and wherein a distance between the first and second surface elements is at least one quarter of a wavelength of the antenna signal transmission.Type: ApplicationFiled: May 27, 2021Publication date: June 29, 2023Inventors: Sam LAI, Rick YANG, Hsi Kai HUNG, Chin Ting HUANG
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Publication number: 20230200452Abstract: An aerosol delivery system comprising an airflow sensor in a sensor chamber defined by one or more chamber walls and a deformable membrane attached to at least one of the one or more chamber walls, wherein the membrane is attached to the one or more chamber walls over more than half of its surface area.Type: ApplicationFiled: May 21, 2021Publication date: June 29, 2023Inventors: Sam LAI, Ping Chou CHEN, Tom WOODMAN
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Publication number: 20230157356Abstract: A delivery device is disclosed and comprises a housing comprising a vent opening, and a battery received in the housing. A membrane formed from a gas permeable material extends over the vent opening.Type: ApplicationFiled: May 11, 2021Publication date: May 25, 2023Inventors: Ping Chou CHEN, Tom WOODMAN, Sam LAI
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Publication number: 20230157357Abstract: A delivery device is disclosed and comprises a housing, a vibration motor for generating haptic feedback to a user, and an elastomeric support member received in the housing. The vibration motor is mounted within the support member. An assembly for insertion into a housing of a delivery device is also disclosed.Type: ApplicationFiled: May 11, 2021Publication date: May 25, 2023Inventors: Ping Chou CHEN, Tom WOODMAN, Sam LAI
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Publication number: 20230133684Abstract: The present disclosure relates to an article for use with an electrically operated non-combustible aerosol delivery system, the article including a generally planar aerosol generating component suspended within an aerosol generating chamber, the chamber having one or more air inlets and one or more outlets defining a flow path therebetween, wherein during activation of the aerosol generating component a first temperature profile having a negative gradient is established along a portion of the flow path from inlet to outlet.Type: ApplicationFiled: March 26, 2021Publication date: May 4, 2023Inventors: Howard Rothwell, Tom Woodman, Sam Lai
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Publication number: 20210285782Abstract: A travel service system makes it possible for a driver to pick up a passenger quickly and accurately. The system obtains map information including real-scene picture information, determines a geographic coordinate, obtains a real-scene picture of the geographic coordinate, and analyzes the real-scene picture to identify a salient object in the real-scene picture. A preferable target position is determined on the basis of the identified salient object. The identified salient object and the preferable target position on the real-scene picture are marked. The real-scene picture with the marked salient object and the preferable marked target position are sent to a receiving terminal.Type: ApplicationFiled: July 17, 2019Publication date: September 16, 2021Inventors: Sam LAI, Andy LIAO
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Patent number: 10950256Abstract: A system and method for text-to-speech performance evaluation are provided. The method (100) for text-to-speech performance evaluation includes providing a plurality of speech samples and scores associated with the respective speech samples (110); extracting acoustic features that influence the associated scores of the respective speech samples from the respective speech samples (120); training a machine learning model by the acoustic features and corresponding scores (130); and evaluating a text-to-speech engine by the trained machine learning model (140).Type: GrantFiled: April 3, 2019Date of Patent: March 16, 2021Assignee: Bayerische Motoren Werke AktiengesellschaftInventors: Lu Chen, Carsten Isert, Sam Lai, Wenhui Lei