Patents by Inventor Sam Lee

Sam Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220376185
    Abstract: Provided are a compound of Formula 7 improving the luminous efficiency, stability and life span of an organic electronic element employing the compound, the organic electronic element, and an electronic device thereof.
    Type: Application
    Filed: June 28, 2022
    Publication date: November 24, 2022
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Won Sam KIM, Hyun Ji OH, Dae Hwan OH, Sun Hee LEE, Soung Yun MUN, Jeong Seok KIM
  • Publication number: 20220370189
    Abstract: Disclosed are an artificial esophageal structure having a multi-layer structure using three-dimensional bio-printing, and a manufacturing device and manufacturing method therefor. The artificial esophageal structure having a multi-layer structure according to one embodiment of the present invention comprises: a first layer in the shape of a hollow column and having a circular cross section; a second layer which is disposed inside the first layer and which is a column structure that simulates the mucosal layer of the esophagus; and an interlayer support part which is disposed between the first layer and the second layer and which maintains a gap between the layers, wherein the first layer and second layer each comprise: a plurality of column parts disposed at predetermined intervals; and a plurality of strands formed between the plurality of column parts by a dragging technique, and may have a porous structure due to pores between the plurality of strands.
    Type: Application
    Filed: September 3, 2020
    Publication date: November 24, 2022
    Inventors: Seung Jae LEE, Jin Ah JANG, Young Sam CHO, Kyoung Duck SEO, Hun Jin JEONG, Hyo Ryung NAM, Ji Hyun KIM, Jae Hee CHUNG, Yeong Gwon JO, Dong Woo CHO, Dong Heon HA
  • Patent number: 11505631
    Abstract: The present invention provides an ethylene/alpha-olefin copolymer having narrow molecular weight distribution together with a low density and an ultra low molecular weight, and minimized number of unsaturated functional groups, and in which a comonomer is uniformly present to show excellent physical properties, and a method for preparing the same.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: November 22, 2022
    Inventors: Jin Sam Gong, Seung Hwan Jung, Jung Ho Jun, Rae Keun Gwak, Choong Hoon Lee, Eun Jung Lee, Hyun Jin Ju, In Sung Park, Sang Eun Park
  • Patent number: 11505725
    Abstract: The present invention provides an adhesive composition including an ethylene/alpha-olefin copolymer; and a tackifier, wherein the ethylene/alpha-olefin copolymer has narrow molecular weight distribution together with a low density and an ultra low molecular weight, minimized number of unsaturated functional groups, uniform crystallinity, thereby showing excellent physical properties.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: November 22, 2022
    Inventors: Rae Keun Gwak, Eun Jung Lee, Jin Sam Gong, Jung Ho Jun, Tae Su Kim
  • Publication number: 20220366512
    Abstract: A computerized payroll system is provided that includes a server having a processor configured to receive from an employee device or from a manager device, a record indicating a total number of hours worked by an employee during a pay period on shifts at different pay rates. The processor is further configured to determine an average pay rate for the total number of hours and any applicable overtime pay rate. The processor is further configured to calculate a benefit amount for the employee. The processor is further configured to display the calculated benefit, display a selector to redeem the calculated benefit, and receive user input via the selector of a request to redeem a requested portion of the calculated benefit, and responsive to receiving the request, initiate a redemption transaction to transfer the requested portion of the calculated benefit to an account identified by the user.
    Type: Application
    Filed: May 11, 2022
    Publication date: November 17, 2022
    Inventors: Joe Fogg, Beth Deutsche, Sam Lee
  • Publication number: 20220367818
    Abstract: Provided are an organic electric element having a first electrode, a second electrode, and at least an organic material layer formed between the first electrode and the second electrode, the organic material layer comprising an emitting layer and the emitting layer comprising a mixture of host materials which improves luminous efficiency, stability, and lifespan of the element; and an organic electronic device comprising the element.
    Type: Application
    Filed: June 9, 2021
    Publication date: November 17, 2022
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Soung Yun MUN, Sun Hee LEE, Jong Gwang PARK, Ki Ho SO, Won Sam KIM, Jung Hwan PARK, Chi Hyun PARK, Mi Young CHAE
  • Publication number: 20220358746
    Abstract: According to an embodiment of the present disclosure, there may be provided an operation method of a server for identifying disaster affected areas. In this instance, the operation method of the server may include acquiring at least one first disaster image; deriving an affected area from each of the at least one first disaster image, and acquiring affected area related information through labeling based on the derived affected area; and training a first learning model using the at least one first disaster image and the affected area related information.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Applicant: NATIONAL DISASTER MANAGEMENT RESEARCH INSTITUTE
    Inventors: Seong Sam KIM, Dong Yoon SHIN, Cheol Kyu LEE
  • Publication number: 20220358774
    Abstract: According to an embodiment of the present disclosure, there may be provided an operation method of a server for estimating the size of damage in disaster affected areas. In this instance, the operation method of the server may include acquiring at least one first disaster image, deriving an affected area from each of the at least one first disaster image, acquiring affected area related information through labeling based on the derived affected area, and training a first learning model using the at least one first disaster image and the affected area related information.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Applicant: NATIONAL DISASTER MANAGEMENT RESEARCH INSTITUTE
    Inventors: Seong Sam KIM, Dong Yoon SHIN, Cheol Kyu LEE
  • Patent number: 11493230
    Abstract: Disclosed is an air conditioner, and more particularly, to an air conditioner having an airflow guide to make the flow of discharged air uniform. An air conditioner comprising a housing having a suction port and a discharge port, a heat exchanger arranged inside the housing, a blower fan configured to suck in air through the suction port, force the air to be subject to heat exchange with the heat exchanger, and discharge the heat-exchanged air through the discharge port, a first blade pivotally arranged to open or close the discharge port and having a first face and a second face opposite of the first face, a first flow path formed between the discharge port and the first face, a second flow path formed between the discharge port and the second face, a second blade movably installed inside the housing and a third blade formed to protrude from the second blade to guide air to the first flow path and the second flow path.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Keun Jeong Jang, Chur Ju Lee, Yong-Sam Kwon, Jang Jung Lee, Eun Sung Jo, Jong Moon Kim, Hyeong Joon Seo
  • Patent number: 11488768
    Abstract: A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: November 1, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sa Yong Lee, Myung Sam Kang
  • Publication number: 20220340698
    Abstract: The present invention relates to a composition for an encapsulant film, including an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and an encapsulant film using the same.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 27, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Jin Sam Gong, Eun Jung Lee, Young Woo Lee, Jung Ho Jun, Jin Kuk Lee, Sang Hyun Hong, Jong Gil Kim, Hye Ji Lee, Sang Wook Han
  • Patent number: 11481274
    Abstract: A data storage system includes a host configured to provide a read request; a plurality of storage devices constituting a redundant array of independent disks (RAID); and a RAID controller configured to a plurality of read commands in response to the read request, the read commands being provided to the plurality of storage devices according to a RAID setting, wherein one data storage device of the plurality of data storage devices includes a nonvolatile memory device; an error handling information storage circuit to store error handling information; and an error detection and correction circuit configured to detect an error in data output from the nonvolatile memory device according to a read command and to selectively correct the error according to the error handling information.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: October 25, 2022
    Assignees: SK hynix Inc., UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Hyunseung Park, Eunjae Lee, Sam Hyuk Noh
  • Publication number: 20220325018
    Abstract: The present invention relates to an olefin-based polymer satisfying conditions as follow: (1) a melt index (MI, 190° C., 2.16 kg load conditions) is from 0.1 g/10 min to 10.0 g/10 min, (2) a density (d) is from 0.860 g/cc to 0.880 g/cc, and (3) T(90)?T(50)?50 and T(95)?T(90)?10 are satisfied when measured by a differential scanning calorimetry precise measurement method (SSA). The olefin-based polymer according to the present invention is a low-density olefin-based polymer introducing a highly crystalline region and showing high mechanical rigidity.
    Type: Application
    Filed: September 28, 2020
    Publication date: October 13, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Sang Eun Park, Eun Jung Lee, In Sung Park, Tae Su Kim, Choong Hoon Lee, Jin Sam Gong, Jung Ho Jun, Rae Keun Gwak
  • Publication number: 20220315747
    Abstract: The present invention relates to a polypropylene-based composite, including (A) polypropylene, and (B) an olefin-based polymer satisfying the following conditions: (1) a melt index (MI, 190° C., 2.16 kg load conditions) is from 0.1 g/10 min to 10.0 g/10 min, (2) a melting temperature when measured by differential scanning calorimetry (DSC) is from 20° C. to 70° C., and (3) a high temperature melting peak is confirmed at 75° C. to 150° C. when measured by a differential scanning calorimetry precise measurement method (SSA), and a total enthalpy of fusion ?H(75) of a corresponding region is 1.0 J/g or more. The polypropylene-based composite of the present invention may show excellent impact strength.
    Type: Application
    Filed: September 28, 2020
    Publication date: October 6, 2022
    Applicant: LG Chem, Ltd.
    Inventors: In Sung Park, Eun Jung Lee, Sang Eun Park, Tae Su Kim, Choong Hoon Lee, Jin Sam Gong, Jung Ho Jun, Rae Keun Gwak
  • Publication number: 20220320409
    Abstract: Provided is a thermoelectric module. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, a heat sink disposed on the second substrate, and an adhesive layer configured to bond the second substrate to the heat sink. The heat sink has a shape in which predetermined patterns are regularly repeated and connected. Each pattern includes a first surface disposed opposite to the second substrate, a in second surface which extends upward from one end of the first surface, a third surface which extends from the second surface to face the second substrate, and a fourth surface which extends upward from the other end opposite to the one end of the first surface and is connected to a third surface of an adjacent pattern.
    Type: Application
    Filed: September 3, 2020
    Publication date: October 6, 2022
    Inventors: Jong Hyun KIM, Young Sam YOO, Se Woon LEE
  • Patent number: 11462498
    Abstract: A semiconductor package includes a frame having a wiring structure and having a recess portion, a semiconductor chip having an active surface with a connection pad disposed thereon and disposed in the recess portion, an encapsulant sealing the semiconductor chip, and a redistribution layer having a first via connected to the connection and a second via connected to a portion of the wiring structure. The semiconductor chip includes a protective insulating film disposed on the active surface and having an opening exposing a region of the connection pad, and a redistribution capping layer connected to the region of the connection pad and extending onto the protective insulating film, and a surface of the redistribution capping layer is substantially the same level as a surface of the portion of the wiring structure, exposed from the first surface.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: October 4, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Jin Park, Sang Kyu Lee, Moon Il Kim, Myung Sam Kang, Jeong Ho Lee, Young Gwan Ko
  • Publication number: 20220306780
    Abstract: An olefin-based polymer satisfying conditions as follow: (1) a melt index (MI, 190° C., 2.16 kg load conditions) is from 0.1 g/10 min to 10.0 g/10 min, (2) a melting temperature when measured by differential scanning calorimetry (DSC) is 20° C. to 70° C., and (3) a high temperature melting peak is confirmed at 75° C. to 150° C. when measured by a differential scanning calorimetry precise measurement method (SSA), and a total enthalpy of fusion ?H(75) of a corresponding region is 1.0 J/g or more. The olefin-based polymer according to the present invention is a low-density olefin-based polymer introducing a highly crystalline region and showing high mechanical rigidity.
    Type: Application
    Filed: September 28, 2020
    Publication date: September 29, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Tae Su Kim, In Sung Park, Sang Eun Park, Eun Jung Lee, Choong Hoon Lee, Jin Sam Gong, Jung Ho Jun, Rae Keun Gwak
  • Publication number: 20220282010
    Abstract: The present invention relates to a composition for an encapsulant film, including an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance, and an encapsulant film using the same.
    Type: Application
    Filed: December 17, 2020
    Publication date: September 8, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Jin Sam Gong, Eun Jung Lee, Young Woo Lee, Jung Ho Jun, Jin Kuk Lee
  • Patent number: 11439040
    Abstract: The present invention relates to a heat exchanger for cooling an electrical device, and more specifically, to a heat exchanger for cooling an electrical device, in which the tube-type cooling path parts may be coupled in multi-stages, the assembling of the electrical device and the cooling path part during the multi-stage coupling is easy, and cooling of both surfaces of the electrical device is possible through tight coupling between the electrical device and the cooling path part.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: September 6, 2022
    Assignee: Hanon Systems
    Inventors: Wi Sam Jo, Jun Young Song, Sun Mi Lee, Hong-Young Lim
  • Patent number: D965974
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: October 11, 2022
    Assignee: JRSK, Inc.
    Inventors: Sam Naparstek, Christie Suozzo, Diana Ong, Jessica Lee