Patents by Inventor Sam Mohanta

Sam Mohanta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120205248
    Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.
    Type: Application
    Filed: April 20, 2012
    Publication date: August 16, 2012
    Applicant: PowerGenix Systems, Inc.
    Inventors: Feng Feng, Jeffrey Phillips, Sam Mohanta, Jeff Barton, Zeiad M. Muntasser
  • Publication number: 20110168565
    Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.
    Type: Application
    Filed: March 23, 2011
    Publication date: July 14, 2011
    Applicant: POWERGENIX SYSTEMS, INC.
    Inventors: Feng Feng, Jeffrey Phillips, Sam Mohanta, Jeff Barton, Zeiad M. Muntasser
  • Publication number: 20090090636
    Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 9, 2009
    Applicant: POWERGENIX SYSTEMS, INC.
    Inventors: Feng Feng, Jeffrey Phillips, Sam Mohanta, Jeff Barton, Zeiad M. Muntasser
  • Patent number: 6383395
    Abstract: A media is used to remove species from aqueous solutions, particularly in the treatment of water to enable it to be suitable for drinking. The media includes a material selected from the group consisting of zirconium hydroxide, titanium hydroxide, hafnium hydroxide and combinations thereof. A preferred form of the media is a layer having an aspect ratio of at least 1:1, more preferably, at least about 10:1. Removed from the water are species selected from the group consisting of arsenate, selenate, chromate, borate, perchlorate, fluoride and combinations thereof. In particular arsenite (As+3) containing species are also removed from water. Arsenite may be removed from water to levels not greater than 10 parts per billion with a single exposure to the media. The media is selective for certain species over others.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: May 7, 2002
    Assignee: Luxfer Group Limited
    Inventors: Stephen R. Clarke, Richard J. Clarke, Roderick Murdock, Clive J. Butler, Sam Mohanta