Abstract: A support for a weighing device, the support comprising: a support part for supporting an object during a weight measurement; and a mounting part for mounting the support on a weighing device; wherein the support part and the mounting part are electrically connected by a component having an electrical resistance greater than or equal to 100 k? and less than or equal to 10 M?.

Abstract: A weighing device for performing a weight measurement on a semiconductor wafer having a specific diameter, the weighing device comprising a weighing pan for supporting the wafer during the weight measurement, wherein: the weighing pan is grounded; and the weighing pan is configured to extend over at least 25% of an area of a surface of the wafer that faces the weighing pan.

Abstract: A device for changing the temperature of a wafer, the device comprising: a surface that is configured to support the wafer and to exchange heat with the wafer, and a space that is configured to receive at least a distal part of an end effector, which is used to support the wafer from beneath, when the end effector is used to lower the wafer onto the surface, wherein the space extends from or to a side of the device; and wherein the space is configured so that the at least a distal part of the end effector can be withdrawn from the space from the side of the device.

Abstract: An apparatus comprising: a weighing device for generating measurement output indicative of the weight of an object loaded on the weighing device; and a disturbance element for temporarily disturbing the measurement output of the weighing device while the object is loaded on the weighing device.