Patents by Inventor Sam Tone Tor
Sam Tone Tor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10181535Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.Type: GrantFiled: February 2, 2015Date of Patent: January 15, 2019Assignee: Tesla, Inc.Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Karl-Josef Kramer, Sean M. Seutter, Sam Tone Tor, Anthony Calcaterra
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Patent number: 9397250Abstract: According to one embodiment, a releasing apparatus for separating a semiconductor substrate from a semiconductor template, the releasing apparatus having an enclosed pressure chamber having at least one gas inlet and at least one gas outlet. A top vacuum chuck for securing a released semiconductor substrate or semiconductor template in the enclosed pressure chamber. A bottom vacuum chuck for securing an attached semiconductor substrate and semiconductor template in the enclosed pressure chamber. A gap between the attached semiconductor substrate and semiconductor template and the top vacuum chuck allowing gas flowing through the gap to generate lifting forces on the attached semiconductor substrate and semiconductor template.Type: GrantFiled: May 3, 2012Date of Patent: July 19, 2016Assignee: Solexel, Inc.Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Sam Tone Tor, Karl-Josef Kramer
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Publication number: 20150144190Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.Type: ApplicationFiled: February 2, 2015Publication date: May 28, 2015Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Karl-Josef Kramer, Sean M. Seutter, Sam Tone Tor, Anthony Calcaterra
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Patent number: 8946547Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.Type: GrantFiled: August 5, 2011Date of Patent: February 3, 2015Assignee: Solexel, Inc.Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Karl-Josef Kramer, Sean M. Seutter, Sam Tone Tor, Anthony Calcaterra
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Publication number: 20130000715Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, attaching a prepeg backplane to the interdigitated pattern of base electrodes and emitter electrodes, forming holes in the prepeg backplane which provide access to the first layer of electrically conductive metal, and depositing a second layer of electrically conductive metal on the backside surface of the prepeg backplane forming an electrical interconnect with the first layer of electrically conductive metal through the holes in the prepeg backplane.Type: ApplicationFiled: March 28, 2012Publication date: January 3, 2013Applicant: SOLEXEL, INC.Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Karl-Josef Kramer, Sean M. Seutter, Sam Tone Tor, Anthony Calcaterra
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Publication number: 20120272490Abstract: The present disclosure relates to methods and apparatuses for releasing a thin semiconductor substrate from a reusable template. The method involves forming a mechanically weak layer conformally on a semiconductor template. Then forming a thin semiconductor substrate conformally on the mechanically weak layer. The thin semiconductor substrate, the mechanically weak layer and the template forming a wafer. Then defining the border of the thin-film semiconductor substrate to be released by exposing the peripheral of the mechanically weak layer. Then releasing the thin-film semiconductor substrate by applying a controlled air flow parallel to said mechanically weak layer wherein the controlled air flow separates the thin semiconductor substrate and template according to lifting forces.Type: ApplicationFiled: May 3, 2012Publication date: November 1, 2012Applicant: SOLEXEL, INC.Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Sam Tone Tor, Karl-Josef Kramer
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Patent number: 8193076Abstract: The present disclosure relates to methods and apparatuses template. The method involves forming a mechanically weak layer conformally on a semiconductor template. Then forming a thin for releasing a thin semiconductor substrate from a reusable semiconductor substrate conformally on the mechanically weak layer. The thin semiconductor substrate, the mechanically weak layer and the template forming a wafer. Then defining the border of the thin-film semiconductor substrate to be released by exposing the peripheral of the mechanically weak layer. Then releasing the thin-film semiconductor substrate by applying a controlled air flow parallel to said mechanically weak layer wherein the controlled air flow separates the thin semiconductor substrate and template according to lifting forces.Type: GrantFiled: June 29, 2010Date of Patent: June 5, 2012Assignee: Solexel, Inc.Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Sam Tone Tor, Karl-Josef Kramer
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Publication number: 20120125256Abstract: Mechanisms are disclosed by which a semiconductor wafer, silicon in some embodiments, is repeatedly used to serve as a template and carrier for fabricating high efficiency capable thin semiconductor solar cells substrates. Mechanisms that enable such repeated use of these templates at consistent quality and with high yield are disclosed.Type: ApplicationFiled: August 13, 2011Publication date: May 24, 2012Applicant: SOLEXEL, INC.Inventors: Karl-Josef Kramer, Mehrdad M. Moslehi, David Xuan-Qi Wang, Subramanian Tamilmani, Sam Tone Tor, Rahim Kavari, Rafael Ricolcol, George Kamian, Joseph Leigh
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Publication number: 20120103408Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.Type: ApplicationFiled: August 5, 2011Publication date: May 3, 2012Applicant: SOLEXEL, INC.Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Karl-Josef Kramer, Sean M. Seutter, Sam Tone Tor, Anthony Calcaterra
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Publication number: 20110021006Abstract: The present disclosure relates to methods and apparatuses for releasing a thin semiconductor substrate from a reusable template. The method involves forming a mechanically weak layer conformally on a semiconductor template. Then forming a thin semiconductor substrate conformally on the mechanically weak layer. The thin semiconductor substrate, the mechanically weak layer and the template forming a wafer. Then defining the border of the thin-film semiconductor substrate to be released by exposing the peripheral of the mechanically weak layer. Then releasing the thin-film semiconductor substrate by applying a controlled air flow parallel to said mechanically weak layer wherein the controlled air flow separates the thin semiconductor substrate and template according to lifting forces.Type: ApplicationFiled: June 29, 2010Publication date: January 27, 2011Applicant: SOLEXEL, INC.Inventors: Mehrdad M. Moslehi, David Xuan-Qi Wang, Sam Tone Tor, Karl-Josef Kramer