Abstract: Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution structure; a first die over and electrically coupled to the first redistribution structure; a first through via over and electrically coupled to the first redistribution structure; an insulation layer extending along the first redistribution structure, the first die, and the first through via; and an encapsulant over the insulation layer, the encapsulant surrounding portions of the first through via and the first die, the encapsulant including conductive fillers at a concentration ranging from 70% to about 95% by volume.

Abstract: Embodiments of the present disclosure are directed to coating compositions, coated articles, and methods in which the coated article is adapted to exhibit a particular permeance profile, such as, for example, a variable water vapor perm rating of about 1 perm or less at 25% average RH and about 15 perms or more at 95% average relative humidity, as tested by ASTM E96 at 21° C.

Abstract: A roof system is secured to a roof deck on a building. The roof system has a thermal energy absorbing product including a desiccant located between the roof deck and a roof barrier. The desiccant reversibly absorbs moisture, and in response thereto, heat is released and absorbed by the desiccant to effect a thermal management of the roof system.

Abstract: Embodiments of the present disclosure are directed to coating compositions, coated articles, and methods in which the coated article is adapted to exhibit a particular permeance profile, such as, for example, a variable water vapor perm rating of about 1 perm or less at 25% average RH and about 15 perms or more at 95% average relative humidity, as tested by ASTM E96 at 21° C.

Abstract: A roof system is secured to a roof deck on a building. The roof system has a thermal energy absorbing product including a desiccant located between the roof deck and a roof barrier. The desiccant reversibly absorbs moisture, and in response thereto, heat is released and absorbed by the desiccant to effect a thermal management of the roof system.

Abstract: A roof system is secured to a roof deck on a building. The roof system has a thermal energy absorbing product including a desiccant located between the roof deck and a roof barrier. The desiccant reversibly absorbs moisture, and in response thereto, heat is released and absorbed by the desiccant to effect a thermal management of the roof system.

Abstract: Certain embodiments described herein are directed articles that include a cellulosic substrate (or a non-cellulosic substrate) and an aqueous dispersion disposed on the substrate. In certain examples, the dispersion is effective to provide a water vapor perm rating of about 2 perms or less at 25% average RH as tested by ASTM D1653, or about 2 perm or less at 25% average RH as tested by ASTM E96, when the dispersion is cured as a coating on the substrate. In some embodiments, the substrate can be (or can be part of) a building substrate such as, for example, kraft paper placed on insulation (e.g., fiberglass insulation) or oriented strand board. In some instances, the aqueous dispersion can include a plant oil macromonomer or a waterborne epoxy resin.

Abstract: A method of reducing the amount of cooling energy required to heat and cool a building is provided. The method includes disposing a porous insulating material in the exterior walls and substantially covering the ceiling in the attic space of the building to a substantial depth. The porous insulating material includes a desiccant. The method further includes permitting the desiccant—bearing porous insulating material to adsorb water moisture from the attic space and then permitting the adsorbed water moisture to desorb from the desiccant—bearing porous insulating material into the enclosed room of the building, resulting in a reduction in the amount of energy required to heat and cool the building.

Abstract: A roof system is secured to a roof deck on a building. The roof system has a thermal energy absorbing product including a desiccant located between the roof deck and a roof barrier. The desiccant reversibly absorbs moisture, and in response thereto, heat is released and absorbed by the desiccant to effect a thermal management of the roof system.

Abstract: A method of reducing the amount of cooling energy required to heat and cool a building is provided. The method includes disposing a porous insulating material in the exterior walls and substantially covering the ceiling in the attic space of the building to a substantial depth. The porous insulating material includes a desiccant. The method further includes permitting the desiccant—bearing porous insulating material to adsorb water moisture from the attic space and then permitting the adsorbed water moisture to desorb from the desiccant—bearing porous insulating material into the enclosed room of the building, resulting in a reduction in the amount of energy required to heat and cool the building.