Patents by Inventor Sam Zinqun Zhao

Sam Zinqun Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for assembling a ball grid array package with two substrates
    Patent number: 7312108
    Abstract: An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: December 25, 2007
    Assignee: Broadcom Corporation
    Inventors: Sam Zinqun Zhao, Reza-ur Rahman Khan, Imtiaz Chaudhry