Abstract: Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.

Abstract: An evaluator board for testing a printed circuit board assembly device subcomponent includes one or more receiving surfaces mounted on the evaluator board, and a securing mechanism positioned over at least one of the one or more receiving surfaces. The receiving surfaces can include a connection base and an electronic receptacle for receiving conductive elements of the subcomponent to be tested. In one implementation, at least one of the one or more receiving surfaces is configured to receive an edge connector of a form factor pluggable printed circuit board. In addition, one or more active and passive circuitry components can be mounted on opposing surfaces of the evaluator board in order to minimize the size and number of components used in the testing of the PCBA subcomponent.

Abstract: An evaluator board for testing a printed circuit board assembly device subcomponent includes one or more receiving surfaces mounted on the evaluator board, and a securing mechanism positioned over at least one of the one or more receiving surfaces. The receiving surfaces can include a connection base and an electronic receptacle for receiving conductive elements of the subcomponent to be tested. In one implementation, at least one of the one or more receiving surfaces is configured to receive an edge connector of a form factor pluggable printed circuit board. In addition, one or more active and passive circuitry components can be mounted on opposing surfaces of the evaluator board in order to minimize the size and number of components used in the testing of the PCBA subcomponent.

Abstract: This disclosure concerns methods for calibrating an operating optoelectronic devices. In one example, a calibration method involves adjusting, at a first temperature, a control parameter until a device operating requirement is satisfied. The associated value of the control parameter is then recorded. This process of adjustment and recording is then repeated at one or more additional temperatures. During operation of the device, an associated temperature is sensed and the control parameter values associated with that temperature are used as a basis for generation of control signals that adjust performance of the device until a device operating requirement is satisfied.

Abstract: Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.

Abstract: A system for using an electrical adapter to test an electrical device is provided. The system includes a tester, an electrical device, and the electrical adapter. The electrical adapter includes a board having first and second planar surfaces, a first electrical socket coupled to the first planar surface of the printed circuit board and a second electrical socket coupled to the second planar surface of the printed circuit board. The board includes electrical connectors electrically coupling the first and second electrical sockets to each other. The first electrical socket of the adapter is suitable for temporary connection to an electrical interface of the tester, and the second electrical socket is suitable for temporary connection to an electrical interface of the electrical device. The electrical device can be one of a plurality of electrical devices and the tester can be one of a plurality of testers.

Abstract: An assembly and method for testing an optical subassembly by locally heating or cooling the optical subassembly. Locally heating or cooling the optical subassembly can include using a thermal transfer assembly. The thermal transfer assembly can include a thermoelectric cooler. A clamping assembly is provided to place the optical subassembly in electrical communication with a testing assembly. The thermal transfer assembly can be associated with the clamping assembly. After achieving the desired temperature, a data stream is transmitted through the optical subassembly and evaluated for compliance.