Abstract: Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, and a radiation shield around the radiation source. The radiation shield includes a wall secured to the support structure, a vacuum bag on the wall, where the vacuum bag has an inside air pressure less than an air pressure outside the vacuum bag, and a lid. The air pressure inside the vacuum bag is less than the atmospheric pressure outside the vacuum bag. When the vacuum is created in the vacuum bag, the vacuum bag deforms and compresses to help provide a vacuum-based mechanical loading that helps to create an applied load on the one or more radiation sources by the lid.

Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis, a first fan including a first outlet and a second outlet, and a second fan having a third outlet and a fourth outlet. In the example electronic device, the first fan is to exhaust air through the first outlet and the second fan is to exhaust air through the third outlet to create a positive pressure in the chassis. The first fan is to exhaust air through the second outlet to an exterior of the chassis, and the second fan is to exhaust air through the fourth outlet to an exterior of the chassis.

Abstract: In one embodiment, a computer system (e.g., a notebook computer) includes a lid with a display and a base coupled to the lid at one end of the base. The base defines one or more openings proximate to the end at which the lid is coupled to the base, and the computer system further includes a solid panel positioned proximate to the openings in the base such that the panel partially blocks the openings of the base. The position of the solid panel with respect to the openings of the base is based on a position of the lid with respect to the base.

Abstract: Devices and systems for cooling using piezoelectricity are disclosed herein. In one example, a device includes a heat pipe, one or more fins thermally coupled to a first end of the heat pipe, where the fins extend laterally from the heat pipe, and one or more piezoelectric structures coupled to the fins.

Abstract: Technical solutions discussed herein include cooling systems for electronic devices, including low-pressure ionic blowers and electromagnetic air movers to improve thermal management in laptops. The cooling system may include multiple blower modules arranged in parallel or series configurations. The thermal solution may be a vapor chamber or a heat pipe, or may include a thin-film air-moving device integrated into an air gap. The cooling system may selectively operate between low pressure blower modules and centrifugal blowers based on cooling demands. The blower module may include an electrode configuration with a single exposed electrode. The cooling system may also incorporate an active noise cancellation system using phase-shifted signals between blower units.

Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis including a first cover and a second cover. The example electronic device also includes a first looped frame spaced apart from the first cover, a second looped frame spaced apart from the second cover, and a printed circuit board between the first looped frame and the second looped frame.

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

Abstract: Methods and apparatus to control airflow in foldable computing devices are disclosed. A disclosed apparatus for use with a foldable computing device includes a barrier carried by at least one of a first folding portion or a second folding portion of the computing device, the first folding portion rotatable relative to the second folding portion, and an actuator to move the barrier in response to a rotation between the first and second folding portions to reduce a flow of air into the foldable computing device.

Abstract: An apparatus for reducing air turbulence in a fan chassis. The chassis including a cutwater extending from a base of the chassis in a continuous or stepwise manner. Wherein a portion of the cutwater extends at one or more acute angles to an axis orthogonal to the base or an axis of an impeller mount of the chassis. Wherein the cutwater may include an aperture or recess that extends from a proximal portion of the cutwater to a distal portion of the cutwater.

Abstract: Heat dissipation systems, apparatus, articles of manufacture, and methods are disclosed. An example computing device includes a display, a keyboard, processor circuitry, and a dual-phase heat dissipation system. The dual-phase dissipation system includes a housing defining a chamber, a fluid inlet, and a fluid outlet. The chamber receives a working fluid via the fluid inlet. A pump fluidly couples to the fluid inlet and the fluid outlet of the housing. The pump is to receive the working fluid via the fluid outlet of the housing and increase at least one of a flow rate or volume of the working fluid at the fluid inlet.

Abstract: Hinge lock apparatus for electronic devices and related methods are disclosed. A system includes a first housing, a second housing, and a hinge to pivotally couple the first housing and the second housing. The hinge includes a hinge lock apparatus having a lock interface and an actuator movable relative to the lock interface between a first position to engage the lock interface to at least one of prevent or restrict rotation of the first housing relative to the second housing, and a second position to disengage the lock interface to enable rotation of the first housing relative to the second housing. Processor circuitry operates the actuator based on a detected condition of the first housing relative to the second housing.

Abstract: An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.

Abstract: Disclosed herein are example systems, apparatus, articles of manufacture, and methods for configuring audio ducts of electronic devices. An example electronic device includes a chassis, a speaker, an audio duct formed on an edge of the chassis, and a deployable door movable between a first position adjacent the chassis and covering the audio duct and a second position exposing the audio duct.

Abstract: Systems, apparatus, articles of manufacture, and methods to reduce fan-induced vibration in electronic devices are disclosed. An example electronic device includes a mainboard; a fan; a chassis including a first cover and a second cover; and at least two of: (a) a fastener to couple the fan to the chassis; and a first dampener positioned between both (1) the fan and the fastener and (2) the fan and the chassis; (b) a plurality of check valves orientated in a first direction; and a plurality of inversed check valves oriented in a second direction different than the first direction, the inverse check valves to change a flow rate of air exhausted from the fan; or (c) a first plurality of second dampeners coupled between the mainboard and the first cover; and a second plurality of second dampeners coupled between the mainboard and the second cover.

Abstract: Impeller architecture for a cooling fan and methodology for making same. The impeller architecture includes a plurality of blades, individual ones of the blades have a first end that is attached to a hub component in a sequential order, such that sequential first ends are attached to the circumference. An indexing function is applied to the sequential order, and blades or the spaces therebetween are modified accordingly to have a blade type based on their sequential location and the indexing function. The indexing function can be, in a non-limiting example, odd numbers or prime numbers.

Abstract: According to the various aspects, the present disclosure is directed to printed circuit board assemblies having a plurality of printed circuit board units or modules that use board connectors for joining the printed circuit board units. In an aspect, the board connector has a first surface, which may be a top surface, and an opposing second surface, which may be a bottom surface, and a plurality of openings, including a first set of connector openings for providing electrical connections between the at least two plurality of printed circuit board units. In another aspect, a method that includes forming a first printed circuit board unit with a first connecting portion and a second printed circuit board unit with a second connecting portion, and the first and second connecting are electrically coupled with the printed circuit board connector.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for magnetic connectors with asymmetric attach/detach mechanism. An example electronic device disclose herein includes a port having an opening to receive a connector and a magnet array associated with the port. The magnet array includes a first magnet, and a second magnet. The electronic device includes a spring to bias at least one of the first magnet or second magnet away from the opening.

Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

Abstract: Technologies for memory on package with reduced package thickness are disclosed. In the illustrative embodiment, a die assembly includes a substrate with a processor die mounted on the top surface and a memory die mounted on the bottom surface. The die assembly is mounted on another substrate, such as a mainboard. A cavity is defined in the mainboard, and the memory die mounted on the bottom surface of the die assembly is positioned in the cavity. Positioning the memory die on the bottom surface of the die assembly can reduce the overall thickness of the die assembly and, therefore, can reduce the overall thickness of a device that incorporates the die assembly.

Abstract: An apparatus includes a memory interposer including a socket including an inner surface, one or more memories disposed on the inner surface, a bottom surface opposite to the inner surface, and pogo pins disposed on the bottom surface and respectively corresponding to the one or more memories, the pogo pins being configured to connect the one or more memories to a printed circuit board (PCB) including a semiconductor die. The apparatus further includes an intermediate thermal head attached to the memory interposer. The memory interposer is movable with respect to the intermediate thermal head.