Abstract: Curable suspensions of an epoxy resin formulation comprisinga) a storage-stable suspension of an epoxy resin and a toughener suspended therein which contains no groups that react with a curable epoxy resin system,b) dicyandiamide, a polycarboxylic acid, a polycarboxylic anhydride, a polyamine, a polyaminoamide, an amino group-containing adduct of an amine and a polyepoxide, a polyol or a catalytically curing hardener, and, as optional components,c) a curing catalyst, conventional fillers or reinforcing materials,are particularly suitable for use as casting resins, laminating resins or adhesives.

Abstract: Epoxy resin compositions which containa) at least one epoxy resin containing, on average, more than one 1,2-epoxy group per molecule,b) an anhydride hardener for the epoxy resin a),c) a toughener, andd) a compound containing two active hydrogen atoms which is capable of reacting with the epoxy resin a) have an outstanding toughness and are suitable as casting resins, laminating resins, moulding compounds, coating compounds and encapsulation systems for electrical and electronic components.

Abstract: The present invention relates to a curable mixture which is useful in the formation of castings and which contains (a) an epoxy resin and (b) a mixture of oligomeric cyanoguanidines obtained by the reaction between a monoisocyanate and a diisocyanate to give a carbodiimide which is subsequently reacted with cyanamide.

Abstract: A storage-stable suspension of an epoxy resin hardener and a toughener useful as a molding composition is prepared via a) the addition of an organic solvent to an aqueous emulsion of the toughener when using a water-sensitive hardener, such as a polycarboxylic anhydride, removing the water as an azeotrope by vacuum distillation, then adding the epoxy resin hardener and removing the residual solvent by vacuum distillation, or b) the addition of an aqueous emulsion of the toughener with or without an organic solvent to the epoxy resin hardener when using a water-insensitive hardener such as a polyamine, and removing the water and any organic solvent by vacuum distillation.

Abstract: Oligomeric cyanoguanidines of formula I ##STR1## wherein, for example, R.sup.1 and R.sup.2 are each phenyl, R is 1,4-phenylene and n is an integer from 1 to 20, are suitable latent hardeners for epoxy resins. They are readily soluble in solvents suitable for the application of epoxy resins, and the cured products obtained therewith have a high glass transition temperature.

Abstract: Oligomeric cyanoguanidines of formula I ##STR1## wherein, for example, R.sup.1 and R.sup.2 are each phenyl, R is 1,4-phenylene and n is an integer from 1 to 20, are suitable latent hardeners for epoxy resins. They are readily soluble in solvents suitable for the application of epoxy resins, and the cured products obtained therewith have a high glass transition temperature.

Abstract: Storage-stable suspension comprised of a solid or liquid epoxy resin hardener and a solid or liquid toughener suspended therein is distinguished by excellent homogeneous dispersion of the toughener in the epoxy resin hardener and are suitable for preparing suspensions of curable epoxy resin compositions.

Abstract: Bisimides of the formula I ##STR1## in which, for example, R.sup.1 is hydrogen, x is 1, y is zero and R is bis-(1,4-phenylene)-methane are intermediates for the preparation of polymers having excellent physical properties, and are suitable for the production of mouldings, coatings and adhesive joints and, in particular, for the production of prepregs and heat-resistant composite materials.

Abstract: Heat-curable compositions of matter which are stable on storage and which contain(a) 10-70 parts by weight of an epoxy resin having a functionality of at least 3,(b) 90-30 parts by weight of an epoxy resin having a functionality of 2-2.5,(c) a diphenol, the amount of the diphenol being so chosen that 0.6-1.2 hydroxyl equivalents of the diphenol (c) are employed per epoxide equivalent of the epoxy resins (a) and (b), and(d) 10-150 parts by weight, relative to 100 parts by weight of the components (a) to (c), of a thermoplastic having phenolic end groups and having a glass transition temperature of at least 150.degree. C. which is compatible with the mixture of the components (a) to (c), are particularly suitable for the production of prepregs for fiber-reinforced composite materials or for the production of adhesive films. The cured shaped articles obtained therefrom are distinguished by a high heat distortion point and excellent mechanical strength properties.

Abstract: Linear polyether resins containing 100 to 1 mol % of the repeating structural unit of formula I ##STR1## and 99 to 0 mol % of the repeating structural unit of formula II ##STR2## wherin A is a linear unsubstituted or methyl-substituted alkylene group containing 1 to 100 carbon atoms in the linear alkylene chain, X denotes bridging groups as defined in claim 1, and Y is an aromatic radical of a divalent phenol as defined in claim 1, are thermoplastics with high glass transition temperatures and excellent mechanical strength properties.

Abstract: Thermosetting reactive systems, comprising(a) at least one epoxide resin,(b) at least one isocyanate resin,(c) a reaction accelerator of the formula I ##STR1## in which R.sup.1 is --(CR.sup.4 R.sup.5).sub.n - with n=2-24, phenylene or naphthylene which is unsubstituted or mono- or poly-substituted by halogen, nitro, C.sub.1 -C.sub.4 -alkyl, C.sub.1-C.sub.4 alkoxy or C.sub.3 -C.sub.8 dialkylaminoalkyl, or a radical of the formulae ##STR2## R.sup.2 and R.sup.3 independently of one another are C.sub.1-C.sub.12 alkyl, phenyl or naphthyl which are unsubstituted or mono- or poly-substituted by halogen, nitro, C.sub.1 -C.sub.4 alkyl or C.sub.1 -C.sub.1 -C.sub.4 alkoxy, or also C.sub.7 -C.sub.13 aralkyl, or in which R.sup.2 and R.sup.3, together with the N atom to which they are linked, form a 5-membered, 6-membered or 7-membered heterocyclic ring, and R.sup.4 and R.sup.5 independently of one another are hydrogen or C.sub.1 -C.sub.

Abstract: The invention relates to copolymers consisting of 30-100 mol %, relative to the total polymer, of structural units of the formulae I and II, the proportion of structural units of the formula I, relative to the proportion of I and II, being 5 to 95 mol %, ##STR1## in which R.sup.1 is C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 alkoxy or halogen, R.sup.2 is hydrogen or --COR.sup.3 and R.sup.3 is C.sub.1 -C.sub.20 alkyl, m is 1, 2 or 3, n is 0, 1, 2, 3 or 4 and the sum of m and n is not more than 5, and A is selected from the group of radicals consisting of halogen, cyano or structural units of the formulae III to VIII ##STR2## in which R.sup.4 and R.sup.6 independently of one another are hydroxyl, ##STR3## or glycidyl groups of the formula IXa or IXb ##STR4## R.sup.5 and R.sup.7 independently of one another are C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.

Abstract: Orthocarbonates of the formula I ##STR1## in which R is C.sub.1 -C.sub.4 alkyl, x is zero, 1 or 2, and A is a trivalent radical derived from an aliphatic triol by omitting the hydroxyl groups, the hydroxyl groups of the triol being bonded to different carbon atoms, are suitable as cocomponents in the curing of epoxy resins in that they limit the reduction in volume occurring during curing of epoxy resins. In addition, the cured resins are distinguished by increased flexural strength and impact strength.

Abstract: Polyether-amides with a specific viscosity of 0.25 to 2.5, measured at 30.degree. C. in a 2% solution in dimethylformamide, containing, based on the total amount of recurring structural elements in the polyether-amide, 100 to 10 mol % of the recurring structural element of the formula I ##STR1## and 90 to 0 mol % of the recurring structural element of the formula II--CO--A.sub.1 --CO--NH--E--NH-- (II)in which A is a radical of the formula ##STR2## in which R and R.sup.1 independently of one another are each a hydrogen, chlorine or bromine atom or methyl, A.sub.1 is an aliphatic, cycloaliphatic, aromatic or heterocyclic-aromatic radical of a dicarboxylic acid or of a dicarboxylic acid derivative, E is a polyether radical of the formula III ##STR3## in which p is a number from 1 to 100, T is phenylene, naphthylene or phenanthrylene, X is --SO.sub.2 --, --CO--, --SO--, --N.dbd.N--, --CF.sub.2 --CF.sub.2 --, ##STR4## in which R.sup.2 is C.sub.1 -C.sub.8 alkyl and R.sup.3 and R.sup.

Abstract: The invention relates to compounds of the formula I ##STR1## in which A is a group ##STR2## R.sup.1 is hydrogen or methyl R.sup.2 is C.sub.1 -C.sub.6 -alkyl, halogen or phenyl,X is a direct C--C bond, --CH.sub.2 -- or --SO.sub.2 --,m is 0, 1, 2 or 3, n is 0, 1 or 2 andp is 0 or, in the case of X=--CH.sub.2 --, can also be an integer from 1 to 6, with the proviso that the groups --A and --O--A are in the ortho-position relative to one another.The compounds can preferably be used as matrix resins for composite materials.The invention also relates to the allyl glycidyl ether intermediates, from which the compounds of the formula I are as a rule prepared by epoxidation with peracids.

Abstract: Polyether resins containing aralkoxy end groups and 100 to 10 mol % of the repeating structural unit of formula II ##STR1## and 90 to 0 mol % of the repeating structural unit of formula III ##STR2## in which formulae A is an unsubstituted or substituted aliphatic radical, X is a bridge member and Y is a radical of a divalent phenol are self-crosslinkable, affording products which are insoluble in organic solvents and which have high glass transition temperatures.

Abstract: Heat-curable mixtures comprising(a) 10-90% by weight of at least one compound of formula I ##STR1## (b) 90-10% by weight of at least one compound of formula II ##STR2## and, based on the sum of (a)+(b), (c) 0-30% by weight of at least one compound which is able to react with component (b),in which formulae above n, m, R, R', R.sub.1, R.sub.2 and R.sub.3 are as define in claim 1, are suitable for the preparation of moulded articles such as prepregs and composites, coatings and bonds.

Abstract: 2,6-Disubstituted 4-epoxypropyl glycidyl ethers of the formula ##STR1## wherein X is a group R' or X is a group of the formula ##STR2## and each of R and R' independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, a halogen atom or C.sub.6 -C.sub.10 aryl, can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for application in the electronics industry, or as adhesives. Compounds of the formula are also valuable reactive diluents for curable epoxy resin mixtures.

Abstract: Heat-curable mixtures comprising(a) 10-90% by weight of at least one compound of formula I ##STR1## (b) 90-10% by weight of at least one compound of formula II ##STR2## and, based on the sum of (a)+(b), (c) 0-30% by weight of at least one compound which is able to react with component (b),in which formulae above n, m, R, R', R.sub.1, R.sub.2 and R.sub.3 are as defined in claim 1, are suitable for the preparation of moulded articles such as prepregs and composites, coatings and bonds.

Abstract: Linear polyether resins containing 100 to 10 mol % of the repeating structural unit of formula I ##STR1## and 90 to 0 mol % of the repeating structural unit of formula II ##STR2## wherein A is a linear unsubstituted or methyl-substituted alkylene group containing 4 to 100 carbon atoms in the linear alkylene chain, X denotes bridge members as defined in claim 1 and Y is an aromatic radical of a divalent phenol as defined in claim 1, are self-crosslinkable and can be crosslinked by heating to a temperature of not less than 250.degree. C. or by irradiation with energy-rich electromagnetic rays, affording products which are insoluble in organic solvents and which have high glass transition temperatures.