Patents by Inventor Sameer Vadhavkar

Sameer Vadhavkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
    Publication number: 20210151400
    Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.
    Type: Application
    Filed: January 4, 2021
    Publication date: May 20, 2021
    Inventors: Giorgio Mariottini, Sameer Vadhavkar, Wayne Huang, Anilkumar Chandolu, Mark Bossler
  • Collars for under-bump metal structures and associated systems and methods
    Patent number: 10886244
    Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: January 5, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Giorgio Mariottini, Sameer Vadhavkar, Wayne Huang, Anilkumar Chandolu, Mark Bossier
  • COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
    Publication number: 20170352633
    Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.
    Type: Application
    Filed: August 23, 2017
    Publication date: December 7, 2017
    Inventors: Giorgio Mariottini, Sameer Vadhavkar, Wayne Huang, Anilkumar Chandolu, Mark Bossler
  • Collars for under-bump metal structures and associated systems and methods
    Patent number: 9780052
    Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: October 3, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Giorgio Mariottini, Sameer Vadhavkar, Wayne Huang, Anilkumar Chandolu, Mark Bossler
  • COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
    Publication number: 20170077052
    Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.
    Type: Application
    Filed: September 14, 2015
    Publication date: March 16, 2017
    Inventors: Giorgio Mariottini, Sameer Vadhavkar, Wayne Huang, Anilkumar Chandolu, Mark Bossler