Patents by Inventor Samer Kabbani
Samer Kabbani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133943Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.Type: ApplicationFiled: December 11, 2023Publication date: April 25, 2024Inventors: Karthik RANGANATHAN, Gregory CRUZAN, Samer KABBANI, Gilberto OSEGUERA, Rohan GUPTE, Homayoun REZAI, Kenneth SANTIAGO, Marc GHAZVINI
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Publication number: 20240133946Abstract: Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.Type: ApplicationFiled: August 23, 2023Publication date: April 25, 2024Inventors: Thomas P. JONES, Samer KABBANI, Chan SEE JEAN, Paul R. HOFFMAN
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Patent number: 11940487Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.Type: GrantFiled: January 9, 2023Date of Patent: March 26, 2024Assignee: Advantest Test Solutions, Inc.Inventors: Samer Kabbani, Kazuyuki Yamashita, Ikeda Hiroki, Ira Leventhal, Mohammad Ghazvini, Paul Ferrari, Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera
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Publication number: 20240027492Abstract: A test apparatus comprising a tester interface board (TIB) affixed in a slot of a tester rack, wherein the TIB comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT). The test apparatus further comprises a carrier comprising an array of DUTs, wherein the carrier is operable to slide into the slot of the tester rack, and wherein each DUT in the array of DUTs aligns with a respective socket on the TIB. Further, the test apparatus comprises a plurality of socket covers, wherein each socket cover of the plurality of socket covers is operable to actuate a top portion of each DUT of the array of DUTs in the carrier.Type: ApplicationFiled: September 30, 2023Publication date: January 25, 2024Inventors: Karthik Ranganathan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal, Koji Miyauchi, Keith Schaub, Amit Kucheriya, Kotaro Hasegawa, Yoshiyuki Aoki
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Publication number: 20240003967Abstract: A stand-alone active thermal interposer device for use in testing an unpackaged integrated circuit device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.Type: ApplicationFiled: May 31, 2023Publication date: January 4, 2024Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan, Todd Berk, Ian Williams, Mohammad Ghazvini, Thomas Jones
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Patent number: 11852678Abstract: Placing a first side of an active thermal interposer device of a thermal management head against a device under test (DUT). Disposing a cold plate against a second side of the active thermal interposer. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to the cold plate, and individually controlling heating of each zone of the plurality of zones.Type: GrantFiled: December 6, 2022Date of Patent: December 26, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Karthik Ranganathan, Gregory Cruzan, Paul Ferrari, Samer Kabbani, Martin Fischer
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Patent number: 11846669Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.Type: GrantFiled: June 15, 2022Date of Patent: December 19, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan, Todd Berk, Ian Williams, Mohammad Ghazvini, Thomas Jones
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Patent number: 11841392Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.Type: GrantFiled: June 3, 2022Date of Patent: December 12, 2023Assignee: Advantest Test Solutiions, Inc.Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Rohan Gupte, Homayoun Rezai, Kenneth Santiago, Marc Ghazvini
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Patent number: 11828795Abstract: Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.Type: GrantFiled: October 21, 2022Date of Patent: November 28, 2023Assignee: AEM Holdings Ltd.Inventors: Thomas P. Jones, Samer Kabbani, Chan See Jean, Paul R. Hoffman
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Patent number: 11821913Abstract: A test apparatus comprising a tester interface board (TIB) affixed in a slot of a tester rack, wherein the TIB comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT). The test apparatus further comprises a carrier comprising an array of DUTs, wherein the carrier is operable to slide into the slot of the tester rack, and wherein each DUT in the array of DUTs aligns with a respective socket on the TIB. Further, the test apparatus comprises a plurality of socket covers, wherein each socket cover of the plurality of socket covers is operable to actuate a top portion of each DUT of the array of DUTs in the carrier.Type: GrantFiled: September 30, 2021Date of Patent: November 21, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Karthik Ranganathan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal, Koji Miyauchi, Keith Schaub, Amit Kucheriya, Kotaro Hasegawa, Yoshiyuki Aoki
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Patent number: 11808812Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.Type: GrantFiled: September 20, 2021Date of Patent: November 7, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal, Hiroki Ikeda, Toshiyuki Kiyokawa
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Patent number: 11796589Abstract: Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.Type: GrantFiled: October 21, 2022Date of Patent: October 24, 2023Assignee: AEM Holdings Ltd.Inventors: Thomas P. Jones, Samer Kabbani, Chan See Jean, Paul R. Hoffman
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Publication number: 20230314512Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.Type: ApplicationFiled: June 6, 2023Publication date: October 5, 2023Inventors: Karthik RANGANATHAN, Gregory CRUZAN, Samer Kabbani, Gilberto Oseguera, Ira Leventhal, Hiroki Ikeda, Toshiyuki Kiyokawa
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Patent number: 11774492Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.Type: GrantFiled: June 15, 2022Date of Patent: October 3, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan, Todd Berk, Ian Williams, Mohammad Ghazvini, Tom Jones
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Publication number: 20230296667Abstract: Placing a first side of an active thermal interposer device of a thermal management head against a device under test (DUT). Disposing a cold plate against a second side of the active thermal interposer. The DUT includes a die and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to the cold plate, and individually controlling heating of each zone of the plurality of zones.Type: ApplicationFiled: May 23, 2023Publication date: September 21, 2023Inventors: Karthik Ranganathan, Gregory Cruzan, Paul Ferrari, Samer Kabbani, Martin Fischer
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Patent number: 11754620Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.Type: GrantFiled: May 13, 2022Date of Patent: September 12, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan, Todd Berk, Ian Williams, Mohammad Ghazvini, Tom Jones
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Patent number: 11742055Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.Type: GrantFiled: November 9, 2022Date of Patent: August 29, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal
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Publication number: 20230228812Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.Type: ApplicationFiled: January 9, 2023Publication date: July 20, 2023Inventors: Samer Kabbani, Kazuyuki Yamashita, Hiroki Ikeda, Ira Leventhal, Mohammad Ghazvini, Paul Ferrari, Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera
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Patent number: 11693051Abstract: Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.Type: GrantFiled: October 21, 2022Date of Patent: July 4, 2023Assignee: AEM Holdings Ltd.Inventors: Thomas P. Jones, Samer Kabbani, Chan See Jean, Paul R. Hoffman
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Publication number: 20230197185Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.Type: ApplicationFiled: February 19, 2023Publication date: June 22, 2023Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal