Abstract: A thermoformed cover and related method for forming the thermoformed cover for an electronic device including at least one body element is made from a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device. The thermoplastic sheet has characteristics such that when the thermoplastic sheet is heated to a suitable temperature, the thermoplastic sheet becomes pliable and stretchable. At least a portion of the heated thermoplastic sheet is made to conform by vacuum, pressure or other suitable means to a mold arranged to substantially correspond to the desired cover for the electronic device. A thermoformed cover corresponding to the desired cover for the electronic device is formed in at least a portion of the thermoplastic sheet and the thermoformed cover is cut away or otherwise separated from the thermoplastic sheet.