Abstract: The heatsink cooling arrangement, fitted to cool a semiconductor component, is transferring heat to a backplate heatsink and secures a mechanical stabile assembly of PCBA, encapsulation, heatsink cooling arrangement to a backplate heatsink, which is fast and easy to assemble with usage of few- or no tools.

Abstract: Apparatus, method and SW for 3D face recognition. The method includes: processing a plurality of initial registrations, each initial registration made by a user, stored in a storage, and including a registration facial image taken with a user apparatus; receiving a current three-dimensional facial image of a current user taken with an authorized three-dimensional camera; searching the plurality of registration facial images for a match with the current three-dimensional facial image based on selected facial features; and if a registration facial image matching with the current three-dimensional facial image is found, confirming the initial registration having the matching registration facial image, and replacing the registration facial image with the current three-dimensional facial image in the storage.