Patents by Inventor Samir Avdic

Samir Avdic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070073008
    Abstract: A composition for use with a lead free solder is provided. In certain examples, the composition comprises an effective amount of a phenol to suppress void formation. Underfill compositions and devices that include the composition are also disclosed.
    Type: Application
    Filed: September 28, 2005
    Publication date: March 29, 2007
    Applicant: Cookson Singapore PTE, LTD.
    Inventors: James Hurley, Senthil Kanagavel, Samir Avdic, Avin Dhoble, Tanya Berfield