Abstract: A method includes receiving feature data defining a plurality of features of a virtual substrate. The method further includes preparing the virtual substrate for display on a graphical user interface (GUI). The method further includes receiving one or more first inputs via the GUI. The one or more first inputs are associated with one or more locations of the virtual substrate. The method further includes defining a three-dimensional measurement probe based on the one or more first inputs. The method further includes outputting a measurement of the measurement probe. The measurement is associated with a characteristic of the virtual substrate measured by the three-dimensional measurement probe.

Abstract: A method includes receiving profile data of a plurality of features of a substrate. The method further includes generating a typical profile based on the profile data of the plurality of features. The method further includes generating a first array of features. Each of the first array of features is based on the typical profile. The method further includes providing the first array of features to a process model. The method further includes obtaining first output from the process model based on the first array of features. The method further includes causing performance of a corrective action in view of the first output from the process model.

Abstract: A method includes receiving, by a processing device, data indicative of a plurality of measurements of a profile of a substrate. The method further includes separating the data into a plurality of sets of data, a first set of the plurality of sets associated with a first region of the profile, and a second set of the plurality of sets associated with a second region of the profile. The method further includes fitting data of the first set to a first function to generate a first fit function. The first function is selected from a library of functions. The method further includes fitting data of the second set to a second function to generate a second fit function. The method further includes generating a piecewise functional fit of the profile of the substrate. The piecewise functional fit includes the first fit function and the second fit function.

Abstract: Various embodiments include approaches for calibrating a model for a lithographic printing process. Some embodiments include a computer-implemented method for calibrating a model for a lithographic printing process. Some approaches include: identifying parameters for a model of the lithographic printing process; assembling a population of design content including potentially printable features that can be printed by the lithographic printing process; preparing at least one matrix expressing a similarity between the potentially printable features in terms of the parameters for the model; determining a manifold of smaller dimensionality than the parameters for the model which exhibit maximum variation in similarity within the at least one matrix; and selecting a sample dataset of the potentially printable features from the manifold.

Abstract: Various embodiments include approaches for calibrating a model for a lithographic printing process. Some embodiments include a computer-implemented method for calibrating a model for a lithographic printing process. Some approaches include: identifying parameters for a model of the lithographic printing process; assembling a population of design content including potentially printable features that can be printed by the lithographic printing process; preparing at least one matrix expressing a similarity between the potentially printable features in terms of the parameters for the model; determining a manifold of smaller dimensionality than the parameters for the model which exhibit maximum variation in similarity within the at least one matrix; and selecting a sample dataset of the potentially printable features from the manifold.

Abstract: A marker layer is placed in regions of a design layout in which an image slope is less than a critical image slope or a perimeter to area ratio is less than a critical perimeter to area ratio. Multiple optical proximity correction (OPC) can be generated by grouping subsets of process conditions at which error mean and/or error root-mean-square (RMS) exceed threshold values. Regions marked with the marker layer are processed with a rigorous OPC employing at least one non-standard resist model, while unmarked regions of the layout are processes with a standard OPC program that is less rigorous than the at least one non-standard resist model. Additionally, number of edges and areal image contrast can be compared among layout clips to determine threshold values for the number of edges and the areal image contrast, which can be employed to determine if multiple OPC is needed for each layout clip.