Patents by Inventor Sammit A. Patel

Sammit A. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230155699
    Abstract: A method of calibrating an active antenna module that includes a radio and an active antenna unit is provide di which information is read from a data storage device that is mounted on the active antenna unit. The radio is connected to the active antenna unit. The radio is calibrated using the information read from the data storage device.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 18, 2023
    Inventors: Chengcheng Tang, Sammit A. Patel, XiaoHua Hou
  • Patent number: 10634550
    Abstract: Aspects of the present disclosure are directed to systems and methods for identifying characteristics of an antenna through detection of vibrational movement of the antenna.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: April 28, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Scott L. Michaelis, Sammit A. Patel
  • Publication number: 20180299321
    Abstract: Aspects of the present disclosure are directed to systems and methods for identifying characteristics of an antenna through detection of vibrational movement of the antenna.
    Type: Application
    Filed: September 28, 2016
    Publication date: October 18, 2018
    Inventors: Scott L. MICHAELIS, Sammit A. PATEL
  • Patent number: 10103692
    Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: October 16, 2018
    Assignee: CommScope Technologies LLC
    Inventors: Sammit A. Patel, Yongjie Xu, Qiyun Gu, Richard W. Brown
  • Patent number: 10090938
    Abstract: For wireless cellular communications, a “smart” multi-band combiner system has a multi-band combiner and a passive inter-modulation (PIM) detection sub-system. The multi-band combiner combines multiple transmit signals in different downlink frequency bands into a single, multi-band transmit signal for transmission from a cell tower antenna. The PIM detection sub-system characterizes the frequency components in the multi-band transmit signal to predict PIM products and determine if any predicted PIM products might interfere with any receive signals in any uplink frequency bands. If so, the PIM detection sub-system generates a signal indicating the presence of such predicted interfering PIM products, and the system installer and/or the network administrator can take remedial action to prevent the PIM products from interfering with user communications.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: October 2, 2018
    Assignee: CommScope Italy, S.r.l.
    Inventors: Sammit A. Patel, Ray K. Butler, John W. Brunner, Xiaohua Hou
  • Publication number: 20170324485
    Abstract: For wireless cellular communications, a “smart” multi-band combiner system has a multi-band combiner and a passive inter-modulation (PIM) detection sub-system. The multi-band combiner combines multiple transmit signals in different downlink frequency bands into a single, multi-band transmit signal for transmission from a cell tower antenna. The PIM detection sub-system characterizes the frequency components in the multi-band transmit signal to predict PIM products and determine if any predicted PIM products might interfere with any receive signals in any uplink frequency bands. If so, the PIM detection sub-system generates a signal indicating the presence of such predicted interfering PIM products, and the system installer and/or the network administrator can take remedial action to prevent the PIM products from interfering with user communications.
    Type: Application
    Filed: January 6, 2015
    Publication date: November 9, 2017
    Inventors: Sammit A. PATEL, Ray K. BUTLER, John W. BRUNNER, Xiaohua HOU
  • Publication number: 20170230011
    Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.
    Type: Application
    Filed: April 29, 2015
    Publication date: August 10, 2017
    Inventors: Sammit A. Patel, Yongjie Xu, Qiyun Gu, Richard W. Brown