Patents by Inventor Sampath D. Purushotaman

Sampath D. Purushotaman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Novel 3D Integration Method using SOI Substrates and Structures Produced Thereby
    Publication number: 20150270172
    Abstract: A process and resultant article of manufacture made by such process comprises forming through vias needed to connect a bottom device layer in a bottom silicon wafer to the one in the top device layer in a top silicon wafer comprising a silicon-on-insulator (SOI) wafer. Through vias are disposed in such a way that they extend from the middle of the line (MOL) interconnect of the top wafer to the buried oxide (BOX) layer of the SOI wafer with appropriate insulation provided to isolate them from the SOI device layer.
    Type: Application
    Filed: June 8, 2015
    Publication date: September 24, 2015
    Applicant: International Business Machines Corporation
    Inventors: Sampath D. Purushotaman, Roy R. Yu