Patents by Inventor Sampath K. KARIKALAN

Sampath K. KARIKALAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with a bridge interposer
    Patent number: 9431371
    Abstract: There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semiconductor package also includes a second active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The second portion of the first active die and the second portion of the second active die include solder balls mounted on a package substrate, and are configured to communicate electrical signals to the package substrate utilizing the solder balls and without utilizing through-semiconductor vias (TSVs).
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: August 30, 2016
    Assignee: Broadcom Corporation
    Inventors: Sampath K. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen
  • SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER
    Publication number: 20150235992
    Abstract: There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semiconductor package also includes a second active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The second portion of the first active die and the second portion of the second active die include solder balls mounted on a package substrate, and are configured to communicate electrical signals to the package substrate utilizing the solder balls and without utilizing through-semiconductor vias (TSVs).
    Type: Application
    Filed: April 30, 2015
    Publication date: August 20, 2015
    Inventors: Sampath K. KARIKALAN, Sam Ziqun ZHAO, Kevin Kunzhong HU, Rezaur Rahman KHAN, Pieter VORENKAMP, Xiangdong CHEN