Patents by Inventor Sampo Humalainen

Sampo Humalainen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pipe assembly for district heating network
    Patent number: 9016327
    Abstract: A pipe assembly for a district heating network, comprising a first pipe, a second pipe and, surrounding the first pipe, a first insulating layer arranged to reduce heat transfer from the first pipe outwards in a radial direction, the first pipe being arranged for a first heat transfer medium flow and the second pipe being arranged for a second heat transfer medium flow. The pipe assembly comprises a heat transfer device arranged to transfer heat from an outer surface of the first insulating layer to the second pipe, and a second insulating layer arranged to reduce heat transfer from the heat transfer device and the second pipe outwards in the radial direction, the thermal conductivity of the heat transfer device being substantially better than the thermal conductivity of the first insulating layer and the thermal conductivity of the second insulating layer.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: April 28, 2015
    Assignee: Sampo Humalainen
    Inventor: Sampo Humalainen
  • PIPE ASSEMBLY FOR DISTRICT HEATING NETWORK
    Publication number: 20140096857
    Abstract: A pipe assembly for a district heating network, comprising a first pipe, a second pipe and, surrounding the first pipe, a first insulating layer arranged to reduce heat transfer from the first pipe outwards in a radial direction, the first pipe being arranged for a first heat transfer medium flow and the second pipe being arranged for a second heat transfer medium flow. The pipe assembly comprises a heat transfer device arranged to transfer heat from an outer surface of the first insulating layer to the second pipe, and a second insulating layer arranged to reduce heat transfer from the heat transfer device and the second pipe outwards in the radial direction, the thermal conductivity of the heat transfer device being substantially better than the thermal conductivity of the first insulating layer and the thermal conductivity of the second insulating layer.
    Type: Application
    Filed: June 15, 2012
    Publication date: April 10, 2014
    Applicant: Sampo Humalainen
    Inventor: Sampo Humalainen