Patents by Inventor Samson Shahbazi
Samson Shahbazi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10910340Abstract: A silver sintering preparation comprising: (A) 30 to 88 wt.-% of silver flake particles having a mean particle diameter (d50) in the range of >1 to 20 ?m, (B) 5 to 30 wt.-% of at least one silver precursor, (C) 1 to 10 wt.-% of an organic polymer system, and (D) 6 to 30 wt.-% of organic solvent, wherein the organic polymer system (C) is chemically essentially stable at temperatures <300° C. and forms a continuous phase together with the organic solvent (D).Type: GrantFiled: October 14, 2019Date of Patent: February 2, 2021Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KGInventors: Ly May Chew, Seigi Suh, Samson Shahbazi, Wolfgang Schmitt
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Patent number: 10074456Abstract: A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d50) of the glass composition is no more than about 5 ?m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.Type: GrantFiled: May 29, 2015Date of Patent: September 11, 2018Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Matthew Sgriccia, Mark Challingsworth, Samson Shahbazi, Ryan Persons, Steven Grabey
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Patent number: 10039180Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.Type: GrantFiled: April 5, 2016Date of Patent: July 31, 2018Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Steven Grabey, Mark Challingsworth, Ryan Persons
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Patent number: 9986650Abstract: A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.Type: GrantFiled: October 30, 2014Date of Patent: May 29, 2018Assignee: Heracus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Steven Grabey
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Patent number: 9892816Abstract: An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of Al2O3, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.Type: GrantFiled: May 5, 2014Date of Patent: February 13, 2018Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Steven Grabey, Mark Challingsworth
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Publication number: 20170303387Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.Type: ApplicationFiled: April 5, 2016Publication date: October 19, 2017Inventors: Samson SHAHBAZI, Steven GRABEY, Mark CHALLINGSWORTH, Ryan PERSONS
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Publication number: 20150348672Abstract: A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d50) of the glass composition is no more than about 5 ?m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.Type: ApplicationFiled: May 29, 2015Publication date: December 3, 2015Inventors: Matthew SGRICCIA, Mark Challingsworth, Samson Shahbazi, Ryan Persons, Steven Grabey
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Patent number: 9183967Abstract: An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.Type: GrantFiled: September 10, 2013Date of Patent: November 10, 2015Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Mark Challingsworth, Steve Grabey, Ryan Persons
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Publication number: 20150257279Abstract: A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.Type: ApplicationFiled: October 30, 2014Publication date: September 10, 2015Inventors: Samson Shahbazi, Steven Grabey
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Publication number: 20150231740Abstract: A method of soldering to a polymer thick film material, comprising the steps of providing a substrate having a polymer thick film layer on at least one surface of the substrate, incorporating a metal preform into the polymer thick film layer such that a surface of the metal preform is exposed, curing the polymer thick film layer to secure the metal preform thereto, and soldering to the exposed surface of the metal preform using a solder material.Type: ApplicationFiled: February 9, 2015Publication date: August 20, 2015Inventors: Steven Grabey, Sarah Groman, Ryan Persons, Samson Shahbazi
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Publication number: 20150004359Abstract: An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of Al2O3, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.Type: ApplicationFiled: May 5, 2014Publication date: January 1, 2015Applicant: Heraeus Precious Metals North America Conshohocken LLPInventors: Samson Shahbazi, Steven Grabey, Mark Challingsworth
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Publication number: 20140224417Abstract: A sealing glass composition including about 30-95 wt % glass or ceramic particles, and about 1-50 wt % organic vehicle, wherein the organic vehicle comprises an acrylic resin component and a solvent, based upon 100% total weight of the sealing glass composition, wherein the composition has a viscosity of at least about 200 kcPs and no more than about 1450 kcPs, is provided. A method of applying a sealing glass composition to a substrate comprising the steps of providing a metal substrate, providing a supporting sheet having a front surface coated with a releasing agent, depositing a sealing glass composition onto the front surface of the releasable sheet, drying the sealing glass composition to form a sealing glass composition decal, removing the sealing glass composition decal from the front surface of the supporting sheet, and placing the dried sealing glass composition decal onto a metal substrate, is provided.Type: ApplicationFiled: February 7, 2014Publication date: August 14, 2014Applicant: Heraeus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Steven Grabey, Mark Challingsworth
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Publication number: 20140178573Abstract: An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.Type: ApplicationFiled: September 10, 2013Publication date: June 26, 2014Inventors: Samson SHAHBAZI, Mark CHALLINGSWORTH, Steve GRABEY, Ryan PERSONS
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Patent number: 4600602Abstract: This invention provides unique resistor compositions. These compositions contain solid long chain phenolic resin, liquid short chain phenolic resin and a mixture of carbon black and graphite particles dispersed therein. The combination of these elements allows for resistor compositions that are capable of withstanding high humidity conditions without significant changes in resistivity and which are capable of low ohmic values in the absence of metals. Also provided is a method of producing these compositions.Type: GrantFiled: July 18, 1984Date of Patent: July 15, 1986Assignee: Rohm and Haas CompanyInventors: Frank W. Martin, Samson Shahbazi
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Patent number: 4595604Abstract: This invention provides conductive compositions that are solderable and flexible and that can be bonded directly to substrates. These compositions are made up of a combination of silver exclusively in the form of flake and resin system, said resin system comprising of vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. Also provided is a method of making these compositions. Another embodiment of this invention is a method of applying conductive compositions directly to substrates by bonding the conductive compositions directly to the substrate. Once cured, the compositions demonstrate good adhesion directly to the substrate in addition to excellent conductivity, solderability and flexibility characteristics.Type: GrantFiled: July 18, 1984Date of Patent: June 17, 1986Assignee: Rohm and Haas CompanyInventors: Frank W. Martin, Samson Shahbazi
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Patent number: 4595606Abstract: This invention provides conductive compositions that are directly solderable and that can be bonded directly to substrates. The compositions are made of silver exclusively in the form of flake and a resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. By making a mixture of such a complex vehicle system a composition is produced that displays outstanding solderability and adhesion. Also provided is a method of making these compositions.Type: GrantFiled: July 18, 1984Date of Patent: June 17, 1986Assignee: Rohm and Haas CompanyInventors: Frank St. John, Samson Shahbazi
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Patent number: 4595605Abstract: This invention provides conductive compositions that are solderable and flexible and that can be bonded directly to substrates. These compositions are made up of a combination of silver exclusively in the form of flake and vinyl chloride/vinyl acetate copolymer. Also provided is a method of making these compositions. Another embodiment of this invention is a method of applying conductive compositions directly to substrates by bonding the conductive compositions directly to the substrate. Once cured the compositions demonstrate good adhesion directly to the substrate in addition to good conductivity, solderability and flexibility characteristics. Additionally, these compositions are capable of being soldered by non silver-bearing solder.Type: GrantFiled: July 18, 1984Date of Patent: June 17, 1986Assignee: Rohm and Haas CompanyInventors: Frank W. Martin, Samson Shahbazi
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Patent number: 4564563Abstract: A solderable electrically conductive composition includes metallic silver particles embedded in a matrix formed from acrylic, carboxylated vinyl and epoxy. The composition is formed by dissolving acrylic powder and vinyl powder in respective solvents to form a first solution and a second solution. The solutions are then mixed with metallic silver particles and an epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvents and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix containing acrylic, vinyl and epoxy, on the substrate.Type: GrantFiled: September 30, 1983Date of Patent: January 14, 1986Assignee: Electro Materials Corp. of AmericaInventors: F. Wayne Martin, Samson Shahbazi, Ronald J. Schoonejongen
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Patent number: 4535012Abstract: A solderable electrically conductive composition includes metallic silver particles embedded in a matrix of carboxylated vinyl and epoxy. The composition is formed by dissolving the vinyl in a solvent to form a solution. The solution is then mixed with the metallic silver particles and the epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvent and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix of vinyl and epoxy, on the substrate.Type: GrantFiled: September 30, 1983Date of Patent: August 13, 1985Assignee: Electro Materials Corp. of AmericaInventors: F. Wayne Martin, Samson Shahbazi, Ronald J. Schoonejongen