Patents by Inventor Samsudin

Samsudin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11388317
    Abstract: A video camera comprises a housing (102) configured of a top housing portion (104), a mid-housing portion (106) and a bottom housing portion (108). The top housing portion is configured as a circular and rounded exterior contoured wall (110) having an exterior recessed feature (112) formed along an edge (114). The mid-housing portion (106) is formed of an IR window ring (116) having an alignment tab (118) extending therefrom, the alignment tab being aligned and recessed within the exterior recessed feature (112) of the rounded exterior contoured wall (110) of the top housing portion (104), and the bottom housing portion (108) providing a camera dome (120) seated within and protruding from the IR window ring (116).
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: July 12, 2022
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Guo Wei Chen, Chi T Tran, Imadi Safwan Samsudin
  • Publication number: 20220093424
    Abstract: The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.
    Type: Application
    Filed: August 2, 2021
    Publication date: March 24, 2022
    Applicant: JABIL INC.
    Inventors: Lim Lai Ming, Zambri Bin Samsudin
  • Publication number: 20210386374
    Abstract: The present disclosure generally relates to a physiological device (100) for an animal The physiological device (100) comprises: a housing (120) comprising a channel (122) therethrough; an attachment layer (140) disposed on the housing (120) for attaching the physiological device (100) to an integument portion (50) of the animal; and a sensor unit (160) comprising a set of physiological sensors (162) for measuring physiological signals from the animal integument portion (50), the sensor unit (160) engageable with the channel (122) for axial displacement within the channel (122), wherein when the device (100) is attached to the animal integument portion (50), the sensor unit (160) is axially displaceable within the channel (122) for adjusting contact with the animal integument portion (50) for measuring the physiological signals.
    Type: Application
    Filed: November 8, 2019
    Publication date: December 16, 2021
    Applicant: Nitto Denko Corporation
    Inventors: Md Irwan Bin Md Kassim, Mohamad Sulhede Bin Samsudin, Ananya Chaithanaboon, Usanee Apijuntarangoon, Visit Thaveeprungsriporn
  • Publication number: 20210360781
    Abstract: A system and method for forming a stretchable conductive circuit package that utilizes an addition and condensation mechanism incorporated into one system. When the stretchable conductive ink is used in a circuit package, the circuit package has high reliability and durability.
    Type: Application
    Filed: May 8, 2018
    Publication date: November 18, 2021
    Applicant: Jabil Inc.
    Inventors: Fakhrozi Che Ani, Zambri Bin Samsudin, Mohd Yusuf Tura Ali, Zulkifli Ahmad
  • Patent number: 11112683
    Abstract: A camera includes an optical camera housing, and a platform disposed at least partially within the optical camera housing. The platform is configured to be pan-rotated about a first axis relative to the optical camera housing. The platform includes a first component configured to be coupled to a camera lens, and a second component having a mount configured to be fixed to an infrared module. The camera also includes a camera lens coupled to the first component of the platform. The camera lens is configured to tilt relative to the platform about a second axis different from the first axis. The camera also includes an infrared module fixed to the mount.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: September 7, 2021
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Imadi Safwan Samsudin, Seng Huan Chuah, Christopher Okrainetz, Ban Hin Ooi
  • Patent number: 11081375
    Abstract: The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: August 3, 2021
    Assignee: JABIL INC.
    Inventors: Lim Lai Ming, Zambri Bin Samsudin
  • Publication number: 20210214528
    Abstract: Disclosed herein is a reinforced polymeric material, where a polymeric matrix material is filled with a 2-dimensional material that has an average aspect ratio of from 100 to 2000 and a fibrous reinforcing material. The composition may optionally also include a curing agent when needed. The material may be useful in providing a moulded material with improved deformation properties.
    Type: Application
    Filed: August 30, 2019
    Publication date: July 15, 2021
    Inventors: Wei Siang SUM, Yin Liong LEONG, Kok Hoong LEONG, Shamsul Farid Samsudin MOHD
  • Publication number: 20200395231
    Abstract: The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.
    Type: Application
    Filed: August 26, 2020
    Publication date: December 17, 2020
    Applicant: JABIL INC.
    Inventors: Lim Lai Ming, Zambri Bin Samsudin
  • Publication number: 20200367367
    Abstract: Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability. A method includes transferring solder paste on to a bottom PCB and forming a bottom PCBA by placing SMT components on the bottom PCB. A middle PCB is stacked on the bottom PCBA and solder paste is transferred on to the middle PCB. A top PCB is stacked on the middle PCB and solder paste is transferred on to the top PCB. SMT components are placed on the top PCB to form a stacked assembly. The stacked assembly is reflowed in a single reflow so that all solder paste simultaneously or nearly simultaneously melts to bond SMT components to respective PCB boards and to bond respective PCBs to each other.
    Type: Application
    Filed: May 15, 2019
    Publication date: November 19, 2020
    Applicant: Jabil Inc.
    Inventors: Zambri Bin Samsudin, Idris Bin Mansor
  • Patent number: 10790172
    Abstract: The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: September 29, 2020
    Assignee: JABIL INC.
    Inventors: Lim Lai Ming, Zambri Bin Samsudin
  • Publication number: 20200267844
    Abstract: Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern on a thermal adhesive film. One or more surface mounted device(s) are attached to a cured printed circuit to form an assembled printed circuit. The assembled printed circuit may be placed on a stretchable substrate. The thermal adhesive film is melted on the assembled printed circuit and the stretchable substrate to protect and reinforce joint bonds and the circuit pattern of the assembled circuit pattern and attach the assembled printed circuit to the stretchable fabric in one melting or curing step.
    Type: Application
    Filed: February 18, 2019
    Publication date: August 20, 2020
    Applicant: Jabil Inc.
    Inventors: LaiMing Lim, Zambri Bin Samsudin
  • Publication number: 20200205295
    Abstract: A method for forming a circuit pattern on an integrated substrate structure includes providing an insulating surface which includes a pattern forming portion. An activation ink is deposited only on the pattern forming portion to form a non-conductive isolation layer. A first metal layer is formed on the non-conductive isolation layer by electroless plating. A patterned portion of the first metal layer is isolated from a remaining portion of the first metal layer to form the circuit pattern. A non-conductive masking layer is applied on the first metal layer. A second metal layer is formed on the non-conductive masking layer. A surface mount land pattern and pad configuration is determined. A solder mask layer is applied to the patterned portion. A protective layer is applied to protect pad areas not covered by the solder mask layer. An electrical component may then be mounted to the pad(s).
    Type: Application
    Filed: June 15, 2017
    Publication date: June 25, 2020
    Applicant: Jabil Inc.
    Inventors: Weiping (aka Jonathan) Wu, Mohd Yusuf Tura Ali, Zambri Samsudin
  • Publication number: 20200058527
    Abstract: The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.
    Type: Application
    Filed: August 17, 2018
    Publication date: February 20, 2020
    Applicant: Jabil Inc.
    Inventors: Lim Lai Ming, Zambri Bin Samsudin
  • Publication number: 20190087445
    Abstract: There is provided a method of facilitating distributed data search in a federated cloud. The method includes generating, at a computing cloud of the federated cloud, a search tree structure for indexing a data set in the computing cloud; mapping a selected set of nodes of the search tree structure to respective peer nodes of a peer-to-peer tree structure spanning a plurality of servers in a plurality of computing clouds of the federated cloud, the peer-to-peer tree structure configured for routing a query for searching a data item in the federated cloud; and informing, for each selected node, the plurality of types of attribute conditions associated with the selected node to the corresponding mapped peer node such that the corresponding mapped peer node has associated therewith the plurality of types of attribute conditions.
    Type: Application
    Filed: March 6, 2017
    Publication date: March 21, 2019
    Inventors: Yongqing ZHU, Quanqing XU, Haixiang SHI, Juniarto SAMSUDIN
  • Patent number: 9976051
    Abstract: There is provided a polymer composition comprising a first polymer phase and a second polymer phase, wherein: a) the first polymer phase comprises a thermoplastic polymer matrix modified with an adhesive functional group or a group which is a precursor of an adhesive functional group; and b) the second polymer phase comprises a thermoplastic polymer capable of acting as a self-healing agent and being chemically reactive on healing of the polymer composition.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: May 22, 2018
    Assignee: Petroliam Nasional Berhad (Petronas)
    Inventors: M. Shamsul Farid Samsudin, M. Azizol A. Wahab, Kok Hoong Leong, Zulkifli Ahamid, Russell John Varley, Carmelo Dell'olio, Stuart Arthur Bateman, Qiang Yuan
  • Publication number: 20160373735
    Abstract: A method for encoding and decoding multi-colored color code for storage of digital data into two-dimensional color codes, where the input data can be either a text file, audio or video files, the color codes comprising 4-bit color cells, allowing for improved and with higher density of data storage and easier decoding to retrieve the original content. After optional steps of applying compression and encryption, the resulting bit-stream is broken into 4-bit units, which is used to translate into 16-color cells. The resulting color cells are distributed around the output color code, to increase the ability of correcting errors that crop up during code transfer.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 22, 2016
    Inventors: NOR FAZLINA IRYANI BINTI ABDUL HAMID, SITI SALWA BINTI SAID, HUSNIZA BINTI RAZALLI, ROZANUDIN BIN SAMSUDIN, ABDUL MANAF BIN MAMAT, SHUHAILI BINTI SAFEE, AHMAD ZAIDEE BIN ABU, ZUBAIRY BIN ISMAAIL, MOHAMAD BIN DRAMAN
  • Patent number: 9525934
    Abstract: A method of estimating a steering vector of a sensor array of M sensors according to one embodiment of the present disclosure includes estimating a steering vector of a noise source located at an angle ? degrees from a look direction of the array using a least squares estimate of the gains of the sensors in the array, defining a steering vector of a desired sound source in the look direction of the array, and estimating the steering vector by performing element-by-element multiplication of the estimated noise vector and the complex conjugate of steering vector of the desired sound source. The sensors may be microphones.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: December 20, 2016
    Assignee: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
    Inventors: Samuel Samsudin Ng, Sapna George, Karthik Muralidhar
  • Patent number: 9480407
    Abstract: A device and method for removal of ambient noise signal from a photoplethysmographic measurement is provided. The method comprises obtaining a first signal waveform based on detecting light based on a first light illumination; obtaining a second signal waveform based on detecting light based on a second light illumination; tuning the first light and second light illumination such that the maximum amplitudes of the first and second signal waveforms are maximized and within a predetermined saturation range, such that ambient light interference for the first and second signal waveforms is reduced; obtaining a third signal waveform based on detecting ambient light; obtaining respective maximum and minimum values of the first and the second signal waveforms; and deriving signal values of the first and second signal waveforms with the removal of ambient noise by subtracting AC and DC average values of the third signal waveform from the first and second signals.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: November 1, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Senthil Kumar, Md. Irwan bin Md. Kassim, Kittipong Kasamsook, Mohamad Sulhede Bin Samsudin, Visit Thaveeprungsriporn
  • Patent number: 9407978
    Abstract: A portable communication device, such as a remote speaker microphone (RSM) (100) is provided with a movable paddle (104) providing a combination speaker grill and push-to-talk actuator. The RSM incorporates drainage paths (110) to prevent moisture from collecting around the movable paddle (104). An internal speaker (502) is retained within the RSM (100) in a stationary manner with sufficient front and back volumes impervious to the actuations of the movable paddle (104). The movable paddle (104) provides improved tactile feedback over a large surface.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: August 2, 2016
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: YiChun Tan, Kah Kin Fong, Beng Gian Ooi, Imadi Safwan Samsudin, Guohonn Wong
  • Patent number: D944730
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: March 1, 2022
    Assignee: Sivantos Pte. Ltd.
    Inventors: Martyn Beedham, Mohammad Shaiful Bin Samsudin