Patents by Inventor Samsung Electronics

Samsung Electronics has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130173884
    Abstract: A programmable device suitable for software defined radio terminal is disclosed. In one aspect, the device includes a scalar cluster providing a scalar data path and a scalar register file and arranged for executing scalar instructions. The device may further include at least two interconnected vector clusters connected with the scalar cluster. Each of the at least two vector clusters provides a vector data path and a vector register file and is arranged for executing at least one vector instruction different from vector instructions performed by any other vector cluster of the at least two vector clusters.
    Type: Application
    Filed: December 7, 2012
    Publication date: July 4, 2013
    Applicants: Samsung Electronics, Imec
    Inventors: Imec, Samsung Electronics
  • Publication number: 20130037849
    Abstract: A method of manufacturing a vertical structure light emitting diode device, the method including: sequentially forming a first conductivity type III-V group compound semiconductor layer, an active layer, and a second conductivity type III-V group compound semiconductor layer on a substrate for growth; bonding a conductive substrate to the second conductivity type III-V group compound semiconductor layer; removing the substrate for growth from the first conductivity type III-V group compound semiconductor layer; and forming an electrode on an exposed portion of the first conductive III-V group compound semiconductor layer due to the removing the substrate for growth, wherein the bonding a conductive substrate comprises partially heating a metal bonding layer by applying microwaves to a bonding interface while bringing the metal bonding layer into contact with the bonding interface.
    Type: Application
    Filed: October 12, 2012
    Publication date: February 14, 2013
    Applicant: SAMSUNG ELECTRONICS
    Inventor: Samsung Electronics