Patents by Inventor Samuel A. Linder

Samuel A. Linder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8072333
    Abstract: A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: December 6, 2011
    Assignee: Avery Dennison Corporation
    Inventors: Scott Wayne Ferguson, David N. Edwards, Peikang Liu, Jason Munn, Ian J. Forster, Samuel A. Linder, Thomas Craig Weakley, David Puleston, Steven C. Kennedy, Christine U. Dang
  • Patent number: 7874493
    Abstract: A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: January 25, 2011
    Assignee: Avery Dennison Corporation
    Inventors: Edward A. Armijo, John F. Hughen, Steven C. Kennedy, Samuel A. Linder, Jason D. Munn
  • Publication number: 20090230198
    Abstract: A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.
    Type: Application
    Filed: May 29, 2009
    Publication date: September 17, 2009
    Applicant: AVERY DENNISON CORPORATION
    Inventors: Edward A. ARMIJO, John F. HUGHEN, Steven C. KENNEDY, Samuel A. LINDER, Jason D. MUNN
  • Patent number: 7555826
    Abstract: A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: July 7, 2009
    Assignee: Avery Dennison Corporation
    Inventors: Edward A. Armijo, John F. Hughen, Steven C. Kennedy, Samuel A. Linder, Jason D. Munn
  • Publication number: 20070216534
    Abstract: A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.
    Type: Application
    Filed: May 23, 2007
    Publication date: September 20, 2007
    Inventors: Scott Ferguson, David Edwards, Peikang Liu, Jason Munn, Ian Forster, Samuel Linder, Thomas Weakley, David Puleston, Steven Kennedy, Christine Dang
  • Publication number: 20070144662
    Abstract: A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.
    Type: Application
    Filed: December 22, 2005
    Publication date: June 28, 2007
    Inventors: Edward Armijo, John Hughen, Steven Kennedy, Samuel Linder, Jason Munn
  • Patent number: 7224280
    Abstract: A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: May 29, 2007
    Assignee: Avery Dennison Corporation
    Inventors: Scott Wayne Ferguson, David N. Edwards, Peikang Liu, Jason Munn, Ian J. Forster, Samuel A. Linder, Thomas Craig Weakley, David Puleston, Steven C. Kennedy, Christine U. Dang
  • Publication number: 20050001785
    Abstract: A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers.
    Type: Application
    Filed: June 18, 2004
    Publication date: January 6, 2005
    Inventors: Scott Ferguson, David Edwards, Peikang Liu, Jason Munn, Ian Forster, Samuel Linder, Thomas Weakley, David Puleston, Steven Kennedy, Christine Dang