Patents by Inventor Samuel A. Thompson, III

Samuel A. Thompson, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5360840
    Abstract: Epoxy resin compositions having improved storage stability before curing and improved thermal and mechanical performance after curing comprise a mixture of a polyepoxide and a curing agent that is reactive with the polyepoxide. The epoxy resin composition is characterized by a glass transition temperature of less than 20.degree. C., measured under standard conditions, after subjecting the epoxy resin composition to a specified thermal cycle. The preferred curing agents are aromatic diamines, for example, 3,7-diaminodibenzothiophene-5,5-dioxide; 3,7-diaminophenothiazine sulfone, 3,7-diamino-N-methylphenothiazine sulfone; 2,7-diamino-9-fluorenone and 2,4,6,8-tetramethyl-3,7-diaminothioxanthene sulfone.
    Type: Grant
    Filed: December 29, 1992
    Date of Patent: November 1, 1994
    Assignee: Hercules Incorporated
    Inventors: Anita N. Chan, Brian J. Swetlin, Samuel A. Thompson, III, Chester R. Willis, Andrew B. Woodside