Patents by Inventor Samuel Abbay

Samuel Abbay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7969733
    Abstract: A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: June 28, 2011
    Assignee: NVIDIA Corporation
    Inventors: Samuel Abbay, Jeong Hun Kim, Don Le