Patents by Inventor Samuel Chu-Chiang Hsu
Samuel Chu-Chiang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240316723Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.Type: ApplicationFiled: June 6, 2024Publication date: September 26, 2024Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 12048981Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.Type: GrantFiled: September 15, 2022Date of Patent: July 30, 2024Assignee: Applied Materials, Inc.Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 12033865Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.Type: GrantFiled: May 17, 2023Date of Patent: July 9, 2024Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Publication number: 20230290645Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.Type: ApplicationFiled: May 17, 2023Publication date: September 14, 2023Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 11682561Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.Type: GrantFiled: April 27, 2021Date of Patent: June 20, 2023Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Publication number: 20230019815Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.Type: ApplicationFiled: September 15, 2022Publication date: January 19, 2023Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 11453099Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.Type: GrantFiled: December 9, 2019Date of Patent: September 27, 2022Assignee: Applied Materials, Inc.Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 11173579Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: GrantFiled: June 25, 2018Date of Patent: November 16, 2021Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Mario David Silvetti, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Publication number: 20210249276Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.Type: ApplicationFiled: April 27, 2021Publication date: August 12, 2021Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 11056350Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.Type: GrantFiled: February 8, 2016Date of Patent: July 6, 2021Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Publication number: 20200114489Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.Type: ApplicationFiled: December 9, 2019Publication date: April 16, 2020Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 10500695Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.Type: GrantFiled: January 11, 2016Date of Patent: December 10, 2019Assignee: Applied Materials, Inc.Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Publication number: 20180304441Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: ApplicationFiled: June 25, 2018Publication date: October 25, 2018Inventors: Hung Chih Chen, Mario David Silvetti, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Patent number: 10022837Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: GrantFiled: December 3, 2015Date of Patent: July 17, 2018Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Patent number: 9610672Abstract: A polishing head for chemical mechanical planarization is provided. The polishing head includes a housing and a flexible membrane secured to the housing. At least a first, second, and third pressurizable chamber are disposed in the housing and each chamber contacts the flexible membrane. A first pressure delivery channel couples to the first chamber. A second pressure delivery channel couples to the third chamber. A first pressure feed line couples the first pressure delivery channel to the second chamber. A second pressure feed line couples the second pressure delivery channel to the second chamber. A first manually movable plug interfaces with the first pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber. A second manually movable plug interfaces with the second pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber.Type: GrantFiled: August 27, 2014Date of Patent: April 4, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Publication number: 20160346897Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.Type: ApplicationFiled: January 11, 2016Publication date: December 1, 2016Applicant: Applied Materials, Inc.Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 9492905Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.Type: GrantFiled: April 6, 2015Date of Patent: November 15, 2016Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Patent number: 9368371Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.Type: GrantFiled: April 22, 2014Date of Patent: June 14, 2016Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Publication number: 20160151879Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.Type: ApplicationFiled: February 8, 2016Publication date: June 2, 2016Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
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Publication number: 20160082571Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: ApplicationFiled: December 3, 2015Publication date: March 24, 2016Inventors: Hung Chih Chen, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate