Patents by Inventor Samuel Gazit

Samuel Gazit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7597722
    Abstract: Process for manufacturing a fabric having distinctive and sharp differentially colored patterns or designs, which process comprises the steps of: (a) producing a first and a second polyamide, said polyamides having different concentrations of amine groups; (b) producing a first and a second polyamides having different concentrations of carboxyl end-groups and sulfonate groups; (c) producing a first yarn from said first polyamide and a second yarn from said second polyamide; (d) making a fabric having first surface areas defined by said first yarn and second surface areas defined by said second yarn; and (e) chemically dyeing said fabric in a dyeing bath comprising at least one anionic (acid) dyestuff and at least one cationic (basic) dyestuff, whereby said first yarn and therefore said first surface areas are dyed predominantly by said anionic dyestuff and said second yarn and therefore said second surface areas are dyed predominantly by said cationic dyestuff.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: October 6, 2009
    Assignee: Nilet Ltd.
    Inventors: Michael Eroshov, Alon Weiser, Thierry Mamodaly, Ran Rotem, Boris Streltses, Ariel Yedvab, Juliana Katz, Alexander Yermolaev, Samuel Gazit
  • Publication number: 20070000065
    Abstract: Process for manufacturing a fabric having distinctive and sharp differentially colored patterns or designs, which process comprises the steps of: (a) producing a first and a second polyamide, said polyamides having different concentrations of amine groups; (b) producing a first and a second polyamides having different concentrations of carboxyl end-groups and sulfonate groups; (c) producing a first yarn from said first polyamide and a second yarn from said second polyamide; (d) making a fabric having first surface areas defined by said first yarn and second surface areas defined by said second yarn; and (e) chemically dyeing said fabric in a dyeing bath comprising at least one anionic (acid) dyestuff and at least one cationic (basic) dyestuff, whereby said first yarn and therefore said first surface areas are dyed predominantly by said anionic dyestuff and said second yarn and therefore said second surface areas are dyed predominantly by said cationic dyestuff.
    Type: Application
    Filed: February 19, 2004
    Publication date: January 4, 2007
    Inventors: Michael Eroshov, Alon Weiser, Thierry Mamodaly, Ran Rotem, Boris Streltses, Ariel Yedvab, Juliana Katz, Alexander Yermolaev, Samuel Gazit
  • Patent number: 6524503
    Abstract: A process for the manufacturing of a differentially dyeable yarn includes the steps of: a) producing two polymers having a different concentration of amine end-groups; b) spinning yarns from said two polymers; and c) producing a yarn by intermingling said spun yarns made from said two polymers, in texturing, or draw twisting, or draw winding processes.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: February 25, 2003
    Assignee: Nilit Ltd.
    Inventors: Samuel Gazit, Ran Rotem, Uri Afek, Martin Blutstein, Alon Weiser
  • Publication number: 20020142160
    Abstract: A process for the manufacturing of a differentially dyeable yarn comprises the steps of: a)producing two polymers having a different concentration of amine end-groups; b) spinning yarns from said two polymers; and c) producing a yarn by intermingling said spun yarns made from said two polymers, in texturing, or draw twisting, or draw winding processes.
    Type: Application
    Filed: March 2, 2001
    Publication date: October 3, 2002
    Inventors: Samuel Gazit, Ran Rotem, Uri Afek, Martin Blutstein, Alon Weiser
  • Patent number: 5972811
    Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature.
    Type: Grant
    Filed: June 4, 1998
    Date of Patent: October 26, 1999
    Assignee: World Properties, Inc.
    Inventors: Michael E. St. Lawrence, Doris I. Hand, Vincent R. Landi, Robert H. Walker, Samuel Gazit, Raymond R. Miskiavitch
  • Patent number: 5571609
    Abstract: An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %; a particulate, preferably ceramic filler in an amount of from 5 to 60 vol. %; a flame retardant and a peroxide cure initiator. A preferred composition has 18% woven glass, 41% particulate filler and 30% thermosetting matrix. The foregoing component ratios and particularly the relatively high range of particulate filler is an important feature of this invention in that this filled composite material leads to a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators.
    Type: Grant
    Filed: October 13, 1994
    Date of Patent: November 5, 1996
    Assignee: Rogers Corporation
    Inventors: Michael E. St. Lawrence, Vincent R. Landi, Doris I. Hand, Robert H. Walker, Samuel Gazit, Raymond R. Miskiavitch
  • Patent number: 5287619
    Abstract: In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper.
    Type: Grant
    Filed: March 9, 1992
    Date of Patent: February 22, 1994
    Assignee: Rogers Corporation
    Inventors: W. David Smith, John A. Olenick, Carlos L. Barton, Jane L. Cercena, Daniel J. Navarro, Kathleen R. Olenick, Angela M. Kneeland, Thomas S. Kneeland, Mark F. Sylvester, Curtis H. Kempton, Scott E. Derosier, Lynn E. Burdick, Richard T. Traskos, Robert B. Huntington, James S. Rivers, Samuel Gazit, Jeffrey B. Ott, William P. Harper
  • Patent number: 5219640
    Abstract: A flexible circuit is presented having a flexing (cyclic bending) section of lower stiffness than adjacent parts of the circuit. The lower stiffness in the flexing section is achieved by reducing the thickness of the flexing section, either by omitting or removing some or all of the dielectric material of the flexible circuit in the flexing section, or by replacing conventional dielectric material in the flexing section with a polymer of lower modulus of elasticity.
    Type: Grant
    Filed: September 11, 1991
    Date of Patent: June 15, 1993
    Assignee: Rogers Corporation
    Inventors: Samuel Gazit, Richard T. Traskos, Leonard S. Calabrese, Michael J. Taylor, Jeffrey B. Otto, Brett W. Kilhenny
  • Patent number: 4997702
    Abstract: A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.
    Type: Grant
    Filed: February 6, 1990
    Date of Patent: March 5, 1991
    Assignee: Rogers Corporation
    Inventors: Samuel Gazit, Gary W. Adams
  • Patent number: 4647508
    Abstract: A flexible circuit laminate is presented comprising a microglass reinforce fluoropolymer layer sandwiched between a fluoropolymer coated polyimide and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the fluoropolymer coated polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass.
    Type: Grant
    Filed: July 15, 1985
    Date of Patent: March 3, 1987
    Assignee: Rogers Corporation
    Inventors: Samuel Gazit, Thomas S. Kneeland
  • Patent number: 4634631
    Abstract: A flexible circuit laminate is presented comprising a microglass reinforced fluoropolymer layer sandwiched between a polyimide substrate and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass. In a method of making the flexible circuit laminate, the polyimide substrate undergoes a preferably alkaline microetching surface treatment, followed by rinsing, drying and lamination to the microglass reinforced fluoropolymer and copper layers.
    Type: Grant
    Filed: July 15, 1985
    Date of Patent: January 6, 1987
    Assignee: Rogers Corporation
    Inventors: Samuel Gazit, Cathy A. Fleischer