Patents by Inventor Samuel Goldfarb

Samuel Goldfarb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060277258
    Abstract: A method, computer program product and system for managing and organizing electronic mail messages. A computer system, referred to as a client, may receive input as to a period of time to organize electronic mail messages. The client may further receive sort criteria which is used to sort incoming electronic mail messages over the designated period of time. The client may then generate either a tabulation summary or a histogram, selected by the user, illustrating the electronic mail messages over the period of time that are sorted according to the received criteria. By displaying relevant information regarding e-mail messages received over a designated period of time in either a tabulation summary or a histogram, the user saves time from digesting and sorting out large volumes of electronic mail messages.
    Type: Application
    Filed: June 6, 2005
    Publication date: December 7, 2006
    Inventor: Samuel Goldfarb
  • Patent number: 5453753
    Abstract: A planar patch array antenna for satellite communications. The antenna includes a planar patch array and a dual axis positioner for rotating the array about azimuth and elevation axes. The dual axis positioner is unique in that it consists of a plurality of individual modules which can be easily assembled and disassembled. The positioner consists of the following modules: a fixed pedestal, an azimuth drive module, an azimuth rotary module, an RF/slip ring module, an elevation drive module, an antenna support and an electronic module. According to the invention, the pedestal remains fixed and the azimuth drive module is received in a recess defined by the pedestal. The azimuth rotary module is rotatably supported on the pedestal and is driven by the azimuth drive module so that it rotates about the vertical or azimuth axis. The elevation drive module is fixed to the rotary drive module and rotatably supports the antenna support module.
    Type: Grant
    Filed: September 8, 1993
    Date of Patent: September 26, 1995
    Assignee: Dorne & Margolin, Inc.
    Inventors: John M. Cosenza, Samuel Goldfarb, Shaun G. Moore
  • Patent number: 4987295
    Abstract: A compound imager consists of two or more individual chips, each with at least one line array of sensors thereupon. Each chip has a glass support plate attached to the side from which light reaches the line arrays. The chips are butted together end-to-end to make large line arrays of sensors. Because of imperfections in cutting, the butted surfaces define a gap. Light entering in the region of the gap is either lost or falls on an individual imager other than the one for which it is intended. This results in vignetting and/or crosstalk near the butted region. The gap is filled with an epoxy resin or other similar material which, when hardened, has an index of referaction near that of the glass support plate.
    Type: Grant
    Filed: March 31, 1989
    Date of Patent: January 22, 1991
    Assignee: General Electric Company
    Inventors: Kenneth P. Kinnard, Richard T. Strong, Jr., Samuel Goldfarb, John R. Tower
  • Patent number: 4760440
    Abstract: A package for solid state image sensor devices, such as CCD image sensors, includes a base plate on which a plurality of the image sensor devices are mounted in end-to-end abutting relation with the detector arrays of the image sensors being over an opening in the base plate, and a cover mounted on the base plate and extending over the image sensor devices to enclose the image sensor devices between the cover and the base plate. The base plate and cover are of polycrystalline silicon so as to have a coefficient of thermal expansion which matches that of the image sensor devices.
    Type: Grant
    Filed: October 31, 1983
    Date of Patent: July 26, 1988
    Assignee: General Electric Company
    Inventors: Robert R. Bigler, Samuel Goldfarb
  • Patent number: 4654472
    Abstract: An improved electronic component or integrated circuit (IC) package characterized by an extraordinary small size for the number of input-output (I/O) leads which are available and capable of use on surface mounted, Flat Pack, hybrid, or through hole (DIP) printed circuit boards. The package has one or more cylindrical or shaped forms at the base, with a flange to provide a stop in order to limit the insertion travel in those circuit boards having through holes, and a top body which is used to house the electronic device. The forms, which protrude down from the upper body (housing), have one or more conductive lead segments, either pins or printed circuit types, running longitudinally and continuing through the housing to the upper body.Each lead segment is connected directly to the electronic device or attached via an additonal lead to a pad on the electronic device, mounted on the upper body. A cover to seal the device is provided.
    Type: Grant
    Filed: December 17, 1984
    Date of Patent: March 31, 1987
    Inventor: Samuel Goldfarb
  • Patent number: 4290705
    Abstract: An electronic line printer characterized by reduced electromagnetic interference, comprising a printer chassis including record medium storage means; a platen mounted on said chassis and adapted to be in contact with the record medium; electronic printing means for contacting said record medium for printing visible symbols on said record medium; and record medium tensioning means for increasing the tension of said record medium in the vicinity of said platen.
    Type: Grant
    Filed: July 9, 1979
    Date of Patent: September 22, 1981
    Assignee: Litton Systems, Inc.
    Inventors: Samuel Goldfarb, Thomas Reilly