Patents by Inventor Samuel Hyland

Samuel Hyland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070017241
    Abstract: Improved means for powering and increasing evaporative cooling in an indirect-direct evaporative cooling (IDEC) apparatus are disclosed. Sustainable energy from solar energy mixed with grid power, when needed, power the IDEC device. These DC and AC power sources are seamlessly merged in a unique diode interconnect unit. Improved means for evaporative cooling include a rayon-based flocking on the wet side of molded plastic indirect evaporative cooling plates. Separate wet and dry passages through those plates are facilitated by a unique means for clamping the upper ends of the plates. These clamping means also add to the structural integrity of an array of plates so that the array can be inserted in and removed from a housing containing other operational components of the IDEC such as fan, direct cooling plates and water distribution means.
    Type: Application
    Filed: September 27, 2006
    Publication date: January 25, 2007
    Applicant: Speakman Company
    Inventors: Samuel Hyland, Robert Lobozo, Covington Stanwick
  • Patent number: 7143597
    Abstract: Improved means for powering and increasing evaporative cooling in an indirect-direct evaporative cooling (IDEC) apparatus are disclosed. Sustainable energy from solar energy mixed with grid power, when needed, power the IDEC device. These DC and AC power sources are seamlessly merged in a unique diode interconnect unit. Improved means for evaporative cooling include a rayon-based flocking on the wet side of molded plastic indirect evaporative cooling plates. Separate wet and dry passages through those plates are facilitated by a unique means for clamping the upper ends of the plates. These clamping means also add to the structural integrity of an array of plates so that the array can be inserted in and removed from a housing containing other operational components of the IDEC such as fan, direct cooling plates and water distribution means.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: December 5, 2006
    Assignee: Speakman Company
    Inventors: Samuel Hyland, Robert F. Lobozo, Covington Stanwick
  • Publication number: 20060000227
    Abstract: Improved means for powering and increasing evaporative cooling in an indirect-direct evaporative cooling (IDEC) apparatus are disclosed. Sustainable energy from solar energy mixed with grid power, when needed, power the IDEC device. These DC and AC power sources are seamlessly merged in a unique diode interconnect unit. Improved means for evaporative cooling include a rayon-based flocking on the wet side of molded plastic indirect evaporative cooling plates. Separate wet and dry passages through those plates are facilitated by a unique means for clamping the upper ends of the plates. These clamping means also add to the structural integrity of an array of plates so that the array can be inserted in and removed from a housing containing other operational components of the IDEC such as fan, direct cooling plates and water distribution means.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventors: Samuel Hyland, Robert Lobozo, Covington Stanwick