Patents by Inventor Samuel Jacob

Samuel Jacob has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080259401
    Abstract: A method and system for achieving consistent color control by integrating multiple color management and rendering techniques using single multi-level user control. Page Description Language (PDL) data and job processing instructions can be modified upstream of the Raster Image Processor (RIP). The processing operations associated with processing a print job comprising of at least one page include at least one of: flattening all objects on the at least one page into a single layer; removing overprint commands from the print job; converting all objects on the at least one page into a common colorspace; removing embedded tone reproduction curves and halftone screens from the print job.
    Type: Application
    Filed: April 23, 2007
    Publication date: October 23, 2008
    Inventors: Michael E. Farrell, Javier A. Morales, William Samuel Jacobs
  • Publication number: 20080146199
    Abstract: A telecommunications device and/or service are provided that enable a user of a receiving device to associate a caller of an incoming call with a response that is appropriate for the caller. The incoming call includes call data that identifies the particular caller. When received, the recipient's device processes the incoming call and sends the associated appropriate response.
    Type: Application
    Filed: December 13, 2006
    Publication date: June 19, 2008
    Inventors: Samuel Jacob HORODEZKY, Manuel E. JAIME, Donald John JONES
  • Patent number: 4090009
    Abstract: Compositions useful for making electrical conductor patterns on a nonconductive substrate, the compositions comprising finely divided Pd/Ag and inorganic binder. The binder is free of bismuth oxide to reduce staining at conductor/resistor interfaces, and comprises certain proportions of glass, copper oxide, and pyrochlore-related oxide (lead ruthenate and/or copper bismuth ruthenate); lead oxide is optional. Despite the absence of bismuth oxide, aged adhesion is good, as is solder acceptance.
    Type: Grant
    Filed: March 11, 1977
    Date of Patent: May 16, 1978
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Samuel Jacob Horowitz
  • Patent number: 4062282
    Abstract: A refuse compactor having structure for preventing displacement of the compactor receptacle beyond a preselected permissible displacement during the compacting operation. The control includes a tilt switch for terminating operation of the compacting ram in the event of a preselected tilt movement of the receptacle during the compacting operation. The control further includes a safety switch preventing operation of the ram when the receptacle is displaced beyond a preselected distance from the compacting position. The displacement limiting structure disclosed herein is carried by the ram so as to be operative during the compacting operation to prevent a movement of the receptacle substantially beyond that effecting an opening of the tilt switch. The ram may be provided with a wiper which may form a portion of the displacement limiting structure.
    Type: Grant
    Filed: August 24, 1976
    Date of Patent: December 13, 1977
    Assignee: Whirlpool Corporation
    Inventors: Samuel Jacob Miller, Erwin George Smith
  • Patent number: 4001146
    Abstract: Compositions useful for making electrical conductor patterns on a nonconductive substrate, the compositions comprising metal powder and 1-5% glass-free inorganic binder. The binder consists essentially of certain amounts of bismuth oxide and oxides of copper and/or lead, and optionally MnB.sub.2 and/or MnO.sub.2. The metal powder is either silver or a mixture of silver with a second metal powder; the second metal powder is Pt, Pd, Au, or an alloy of Cu with one or more of Pt, Pd, Au, and Ag. The weight ratio of Ag to other metals is at least 17/1. These compositions are useful for making conductor patterns on substrates, which patterns have good adhesion to the substrate, both initially and after thermal aging (e.g., 150.degree. C. for 48 hours).
    Type: Grant
    Filed: February 26, 1975
    Date of Patent: January 4, 1977
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Samuel Jacob Horowitz