Patents by Inventor Samuel Jiang

Samuel Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimentional packaging method and package structure of photonic-electronic chip
    Patent number: 11789218
    Abstract: The present disclosure provides a three-dimensional packaging method and a three-dimensional package structure of a photonic-electronic chip. The method includes: fixing an electronic chip on a first area of a first surface of a photonic chip; fixing a dummy chip on a second area of the first surface of the photonic chip, wherein the photonic chip is provided with an optical coupling interface at the second area, and the dummy chip has a cavity with a single-sided opening, and the opening of the cavity faces and covers an optical coupling interface.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: October 17, 2023
    Assignee: Hangzhou Guangzhiyuan Technology Co., Ltd.
    Inventors: Yichen Shen, Samuel Jiang, Shanshan Yu
  • THREE-DIMENTIONAL PACKAGING METHOD AND PACKAGE STRUCTURE OF PHOTONIC-ELECTRONIC CHIP
    Publication number: 20220365295
    Abstract: The present disclosure provides a three-dimensional packaging method and a three-dimensional package structure of a photonic-electronic chip. The method includes: fixing an electronic chip on a first area of a first surface of a photonic chip; fixing a dummy chip on a second area of the first surface of the photonic chip, wherein the photonic chip is provided with an optical coupling interface at the second area, and the dummy chip has a cavity with a single-sided opening, and the opening of the cavity faces and covers an optical coupling interface.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 17, 2022
    Inventors: Samuel Jiang, Yichen Shen