Patents by Inventor Samuel Kyran

Samuel Kyran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240010794
    Abstract: A self-healing resin composition of a polymer formed from the reaction between a thermoplastic polymer having terminal functional groups and a benzoxazine compound is provided. Also provided is a method of forming such a self-healing resin composition. A method of self-healing an article is also provided. In such a method, an article may have a rupture, and may be formed from a polymer resulting from reaction between a thermoplastic polymer having terminal functional groups and a benzoxazine compound. The method may include maintaining the article formed from the polymer at a predetermined temperature for a predetermined time such that the rupture is repaired.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 11, 2024
    Applicant: KANEKA CORPORATION
    Inventor: Samuel Kyran
  • Publication number: 20230174718
    Abstract: A hybrid thermoplastic-thermosettable resin composition may include a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic. A method of forming a hybrid thermoplastic-thermosettable resin composition may include reacting a thermoplastic to introduce a cross-linkable group to form the thermoplastic-thermosettable resin composition. A method of forming a hybrid thermoplastic-thermoset resin may include providing a hybrid thermoplastic-thermosettable resin composition comprising a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic; and curing the hybrid thermoplastic-thermosettable resin composition by an external stimulus to form the hybrid thermoplastic-thermoset resin.
    Type: Application
    Filed: March 31, 2021
    Publication date: June 8, 2023
    Applicant: KANEKA CORPORATION
    Inventors: Samuel Kyran, Masahiko Miyauchi, Tianlei Zhou
  • Publication number: 20230084211
    Abstract: A degradable resin composition comprising at least one benzoxazine group in a backbone or as an endcap and at least one cleavable covalent bond is provided. Also provided is a thermoset composition comprising a cured benzoxazine-based resin composition including at least one imine group. A degradable resin composition comprising at least one benzoxazine group in a backbone or an endcap, at least one acetal group, and at least one acrylate group is also provided. A method of recycling a resin composition includes providing a cured polymer resin composite which comprises a cured benzoxazine-based resin composition including at least one cleavable covalent bond, and fibers. The method then includes exposing the cured polymer resin composite to an acid, thereby cleaving the at least one cleavable covalent bond to produce a degraded polymer resin, and removing the fibers from the degraded polymer resin.
    Type: Application
    Filed: August 19, 2022
    Publication date: March 16, 2023
    Applicant: KANEKA CORPORATION
    Inventors: Samuel Kyran, Young Hoon Lim
  • Publication number: 20210054147
    Abstract: Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4?-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate.
    Type: Application
    Filed: March 4, 2019
    Publication date: February 25, 2021
    Applicant: Kaneka Americas Holding, Inc.
    Inventors: Samuel Kyran, Hiroyuki Furutani