Abstract: Porting a first integrated circuit design targeted for implementation in a first semiconductor manufacturing process, and implementing a second circuit design in a second semiconductor manufacturing process wherein the electrical performance of the second integrated circuit meets or exceeds the requirements of the first integrated circuit design even if the threshold voltage targets of the second integrated circuit design are different from those of the first integrated circuit design; and wherein physical layouts, and in particular the gate-widths and gate-lengths of the transistors, of the first and second integrated circuit designs are the same or substantially the same. The second integrated circuit design, when fabricated in the second semiconductor manufacturing process and then operated, experiences less off-state transistor leakage current than does the first integrated circuit design, when fabricated in the first semiconductor manufacturing process, and then operated.

Abstract: An integrated circuit having at least one array of circuit cells, each circuit cell having a plurality of transistors each performing a specified function, the transistors having predefined performance parameter margins for the specified function, the circuit cells designed by providing at least one operating condition for the circuit cell; providing a value of sigma over a predefined range; determining for each transistor, at least one variable transistor characteristic, which is defined by a semiconductor process that results in transistors having such transistor characteristics; providing an array of instances based upon the value of the sigma and using a design of experiments factorial calculation; providing a metric of interest by which to deter-nine pass/fail instances; extracting individual pass/fail instances for the metric of interest; and determining a yield for the array of circuit cells for the targeted operating condition.

Abstract: Porting a first integrated circuit design targeted for implementation in a first semiconductor manufacturing process, and implementing a second circuit design in a second semiconductor manufacturing process wherein the electrical performance of the second integrated circuit meets or exceeds the requirements of the first integrated circuit design even if the threshold voltage targets of the second integrated circuit design are different from those of the first integrated circuit design; and wherein physical layouts, and in particular the gate-widths and gate-lengths of the transistors, of the first and second integrated circuit designs are the same or substantially the same. The second integrated circuit design, when fabricated in the second semiconductor manufacturing process and then operated, experiences less off-state transistor leakage current than does the first integrated circuit design, when fabricated in the first semiconductor manufacturing process, and then operated.

Abstract: Embodiments of a threshold logic element are provided. Preferably, embodiments of the threshold logic element discussed herein have low leakage power and high performance characteristics. In the preferred embodiment, the threshold logic element is a threshold logic latch (TLL). The TLL is a dynamically operated current-mode threshold logic cell that provides fast and efficient implementation of digital logic functions. The TLL can be operated synchronously or asynchronously and is fully compatible with standard Complementary Metal-Oxide-Semiconductor (CMOS) technology.

Abstract: Embodiments of a threshold logic element are provided. Preferably, embodiments of the threshold logic element discussed herein have low leakage power and high performance characteristics. In the preferred embodiment, the threshold logic element is a threshold logic latch (TLL). The TLL is a dynamically operated current-mode threshold logic cell that provides fast and efficient implementation of digital logic functions. The TLL can be operated synchronously or asynchronously and is fully compatible with standard Complementary Metal-Oxide-Semiconductor (CMOS) technology.