Abstract: The present disclosure relates to a method, apparatus and computer program product for managing service containers. According to example implementations of the present disclosure, there is provided a method for managing a group of service containers. In the method, in response to receiving a backup demand on a group of to-be-generated service containers, a configuration file for generating the group of service containers is built on the basis of the backup demand, the configuration file comprising scripts for installing backup agencies that perform backup operations to the group of service containers. An image file for initializing the group of service containers is loaded to at least one node in a service container management system so as to create a group of basic running environments.

Abstract: The present disclosure relates to a method, apparatus and computer program product for managing service containers. According to example implementations of the present disclosure, there is provided a method for managing a group of service containers. In the method, in response to receiving a backup demand on a group of to-be-generated service containers, a configuration file for generating the group of service containers is built on the basis of the backup demand, the configuration file comprising scripts for installing backup agencies that perform backup operations to the group of service containers. An image file for initializing the group of service containers is loaded to at least one node in a service container management system so as to create a group of basic running environments.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: A management user interface can be generated at run time via subtractive extensible context-based filtering. Definitions of user interface elements can include an indication of appropriate contexts for which the user interface elements are to be shown. Context factors can include application state, external state, surface or element definitions, or some combination thereof. The context-based filtering approach allows definition of user interface elements and user interface surfaces so that appearance of additional elements in the appropriate surfaces can be accomplished without programming. For example, a user interface surface definition can specify categories of user interface elements. At run time, those user interface elements of the category can be chosen for display. When new elements relating to the category are added, the new elements appear when the surface is rendered. Other features include heterogeneous type selection and exact number homogeneous type selection.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: The present invention provides expression vectors that facilitate high levels of expression of GPCR proteins. Encompassed by the invention are methods and compositions for recombinant cell lines expressing GPCR proteins with the aid of the expression vectors of the instant invention. The recombinant cell lines of the instant invention express GPCR proteins at levels of at least about 150,000 copies of the protein per cell. The present invention also provides methods and compositions for raising antibodies against GPCR proteins using the high expressing recombinant cells of the instant invention.

Abstract: Compositions and methods for the therapy and diagnosis of cancer, particularly prostate cancer, are disclosed. Illustrative compositions comprise one or more prostate-specific polypeptides, immunogenic portions thereof, polynucleotides that encode such polypeptides, antigen presenting cell that expresses such polypeptides, and T cells that are specific for cells expressing such polypeptides. The disclosed compositions are useful, for example, in the diagnosis, prevention and/or treatment of diseases, particularly prostate cancer.

Abstract: Compositions and methods for the therapy and diagnosis of cancer, such as prostate cancer, are disclosed. Compositions may comprise one or more prostate-specific proteins, immunogenic portions thereof, or polynucleotides that encode such portions. Alternatively, a therapeutic composition may comprise an antigen presenting cell that expresses a prostate-specific protein, or a T cell that is specific for cells expressing such a protein. Such compositions may be used, for example, for the prevention and treatment of diseases such as prostate cancer. Diagnostic methods based on detecting a prostate-specific protein, or mRNA encoding such a protein, in a sample are also provided.