Abstract: An electronic device is disclosed herein. An embodiment of the electronic device comprises an electronic component, wherein the electronic component is operated by a DC voltage. The electronic component comprises an AC to DC converter that converts an AC voltage to the DC voltage, wherein the RMS value of the AC voltage is greater than the DC voltage. The electronic device further comprises a power supply comprising an input and an output. The input is connectable to a line voltage and the output is connected to the AC to DC converter of electronic component. The AC voltage is output by the output of the power supply.

Abstract: Systems and methods for providing redundant voltage regulation are provided. A representative method incorporates: providing a first voltage regulator and a second voltage regulator, the second voltage regulator having output rectifiers; electrically connecting the first voltage regulator to a load such that the first voltage regulator independently powers the load; disabling the output rectifiers of the second voltage regulator; detecting a fault of the first voltage regulator; responsive to the fault, enabling the output rectifiers of the second voltage regulator such that the second voltage regulator independently powers the load.

Abstract: A control logic detects voltage regulator failure in a power supply. The control logic comprises first and second lines configured for respective connection to a controller node and a phase node of a voltage regulator, a delay element coupled to the first line configured to delay signals at the controller node into alignment with signals at the phase node, and a level detector coupled to the second line configured to convert the signals at the phase node into at least two digital representations indicative of respective signal thresholds. A logic compares timing of the delayed signals with the digital representations and detects occurrence of a voltage regulator fault based on the timing comparison.

Abstract: Power supplies are disclosed herein. One embodiment of a power supply comprises a first input and a second input, wherein the first input and the second input are connectable to a pulse width modulation controller and wherein a pulse width modulation signal is outputable from the pulse width modulation controller. A power stage connected to the first input and the second input. A first comparator having a first comparator first input is connected to the first input and a first comparator second input connected to the output of the power stage. A change of voltage at the output of the first comparator constitutes a difference in phase between the first input and the output of the power stage.

Abstract: Systems and methods for providing redundant voltage regulation are provided. A representative method incorporates: providing a first voltage regulator and a second voltage regulator, the second voltage regulator having output rectifiers; electrically connecting the first voltage regulator to a load such that the first voltage regulator independently powers the load; disabling the output rectifiers of the second voltage regulator; detecting a fault of the first voltage regulator; responsive to the fault, enabling the output rectifiers of the second voltage regulator such that the second voltage regulator independently powers the load.

Abstract: A method for reducing commutation-related acoustic noise in a fan system is provided. A constant frequency periodic signal is generated and a fan commutation event is synchronized with a zero level value of the constant frequency periodic signal. A system for controlling a direct current fan is provided. The system comprises a signal generator adapted to produce a periodic signal of a constant frequency and a phase-locked loop. A zero level value of the periodic signal is synchronized with a commutation event of the fan.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: A decoupling circuit on a printed circuit board is disclosed. The decoupling circuit comprises an electrical filter circuit electrically connected between an interconnect post and a ground land of the printed circuit board. The ground land is connected to a ground plane in the printed circuit board. The electrical filter shunts conducted interfering signals received at the interconnect post to the ground plane. Components of the electrical filter circuit and ground plane form a first receiver loop in which induced interfering signals can be generated. The decoupling circuit also comprises a second receiver loop comprising a conductive coating of an EMI shield conformingly adhered to surfaces of the decoupling circuit, and a conductive path of the first receiver loop. The second receiver loop is adapted to have induced therein a signal having a direction and magnitude sufficient to cancel interfering signals induced in the first receiver loop.

Abstract: An electrostatic precipitator that removes zinc whiskers from cooling air provided to cool components in an electronics enclosure. The electrostatic precipitator comprises an ionizer configured to apply a charge to zinc whiskers suspended in the cooling air. The electrostatic precipitator also comprises a collector that collects charged zinc whiskers from the contaminated cooling air to generate uncontaminated cooling air for cooling the components of the electronics enclosure. The electrostatic precipitator is configured to be disposed in the cooling air flow path upstream of the components such that the cooling air travels through the electrostatic precipitator prior to impinging on the components.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: A decoupling circuit on a printed circuit board is disclosed. The decoupling circuit comprises an electrical filter circuit electrically connected between an interconnect post and a ground land of the printed circuit board. The ground land is connected to a ground plane in the printed circuit board. The electrical filter shunts conducted interfering signals received at the interconnect post to the ground plane. Components of the electrical filter circuit and ground plane form a first receiver loop in which induced interfering signals can be generated. The decoupling circuit also comprises a second receiver loop comprising a conductive coating of an EMI shield conformingly adhered to surfaces of the decoupling circuit, and a conductive path of the first receiver loop. The second receiver loop is adapted to have induced therein a signal having a direction and magnitude sufficient to cancel interfering signals induced in the first receiver loop.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: A power management system for use in a power-consuming system is disclosed. The system comprises one or more power module bays each adapted to have a power module hot-pluggably installed therein, the power module comprising an uninterruptible power supply (UPS) power module and a power supply unit (PSU) power module each adapted to be installed in the one or more power module bays; and a power module interface that connects power signals generated by installed power modules with one or more power buses in the system.

Abstract: An electrostatic precipitator that removes zinc whiskers from cooling air provided to cool components in an electronics enclosure. The electrostatic precipitator comprises an ionizer configured to apply a charge to zinc whiskers suspended in the cooling air. The electrostatic precipitator also comprises a collector that collects charged zinc whiskers from the contaminated cooling air to generate uncontaminated cooling air for cooling the components of the electronics enclosure. The electrostatic precipitator is configured to be disposed in the cooling air flow path upstream of the components such that the cooling air travels through the electrostatic precipitator prior to impinging on the components.

Abstract: A decoupling circuit on a printed circuit board is disclosed. The decoupling circuit comprises an electrical filter circuit electrically connected between an interconnect post and a ground land of the printed circuit board. The ground land is connected to a ground plane in the printed circuit board. The electrical filter shunts conducted interfering signals received at the interconnect post to the ground plane. Components of the electrical filter circuit and ground plane form a first receiver loop in which induced interfering signals can be generated. The decoupling circuit also comprises a second receiver loop comprising a conductive coating of an EMI shield conformingly adhered to surfaces of the decoupling circuit, and a conductive path of the first receiver loop. The second receiver loop is adapted to have induced therein a signal having a direction and magnitude sufficient to cancel interfering signals induced in the first receiver loop.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: An EMI containment assembly for an integrated circuit chip. A frame forms an eletrically conductive wall around the perimeter of the integrated circuit chip. The bottom of the frame makes an electrically conductive contact with a ground trace on the printed circuit board to which the chip is mounted. The top of the frame makes an electrically conductive contact with an electrically conductive heat removal assembly that is disposed over the top of the chip. An electrically conductive bolster plate is mounted on the side of the printed circuit board opposite the integrated circuit chip and is disposed beneath the chip. Because each component of the assembly is electrically conductive, the assembly creates an EMI cage around the integrated circuit chip. Because the frame does not cover the top of the chip, it does not interfere with a thermally conductive contact that is made between the top of the chip package and the heat removal assembly.

Abstract: A computer is disclosed having a power supply assembly that may be rotated into a first position for operating the computer, rotated into a second position for servicing components within the computer, or removed from the computer quickly and easily. The power supply assembly is mounted to a chassis via first and second pivot pins that define an axis of rotation and engage first and second bearing surfaces. The first pivot pin may be disengaged from the first bearing surface without removing a fastener. In one embodinent, the first pivot pin is disengaged from the first bearing surface by relative movement between the first pivot pin and the first bearing surface along the axis of rotation. In another embodiment, the first pivot pin is disengaged from the first bearing surface by passing it through a slot in the bearing surface orthogonal to the axis of rotation.

Abstract: A two-piece bus bar electrically couples a printed circuit board to a power supply. The power supply is mounted to a chassis. A power supply bus bar extends from the power supply, defining a power supply bus bar plane. A first printed circuit board is mounted to the chassis and oriented in a plane that is not parallel with the power supply bus bar plane. A first printed circuit board bus bar extends from the first printed circuit board. At least one of the power supply bus bar or the first printed circuit board bus bar includes a bend that creates a parallel relationship between a mating portion of the power supply bus bar and a mating portion of the first printed circuit board bus bar. A first fastener couples the mating portions of the bus bars together. A second printed circuit board may be mounted to the chassis and oriented in a plane at right angles with the power supply bus bar plane.