Patents by Inventor Samuel Muen SHYU

Samuel Muen SHYU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11431117
    Abstract: A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: August 30, 2022
    Assignee: Lockheed Martin Corporation
    Inventors: Samuel Muen Shyu, Raymond Yu, Robert James Hill
  • Publication number: 20210151913
    Abstract: A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.
    Type: Application
    Filed: January 26, 2021
    Publication date: May 20, 2021
    Inventors: Samuel Muen SHYU, Raymond YU, Robert James HILL
  • Publication number: 20210066827
    Abstract: A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 4, 2021
    Applicant: Lockheed Martin Corporation
    Inventors: Samuel Muen SHYU, Raymond YU, Robert James HILL