Patents by Inventor Samuel O. Polk

Samuel O. Polk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect for Printed Board Assembly
    Publication number: 20100232121
    Abstract: A printed board includes a base printed board including a trace; an electronic component operably associated with the base printed board; and a dielectric connector build-up extending from the base printed board. The dielectric connector build-up defines a via. The printed board further includes a land attachment site disposed in the via. The land attachment site extends through the dielectric connector build-up and into the base printed board. The land attachment site is electrically coupled with the trace and is configured to be electrically coupled to another printed board by one of an electrically conductive compound and a flowed solder ball.
    Type: Application
    Filed: August 29, 2008
    Publication date: September 16, 2010
    Inventors: Glen C. Oliver, Thomas E. Byrd, Alan L. Phillips, Charles Donald Dupriest, Samuel O. Polk