Abstract: An edge surface includes a first peripheral surface extending between a first major surface and an outer peripheral surface of a substrate. The first peripheral surface includes a first depth and a first width. In aspects, the first depth is from about 4 micrometers to about 12 micrometers, and the first width is from about 30 micrometers to about 50 micrometers. In aspects, the first depth is from about 14 micrometers to about 24 micrometers, and the first width is from about 40 micrometers to about 60 micrometers. In aspects, a ratio of the first depth to a substrate thickness is from about 0.2 to about 0.4, a ratio of the first width to the substrate thickness is from about 1 to about 1.55, and a ratio of the first width to the first depth is from about 2 to about 8.

Abstract: Methods of forming a foldable substrate comprise providing a glass-based substrate comprising a first compressive stress region extending to an existing first depth of compression from an existing first major surface. Methods comprise contacting the existing first major surface with a solution to remove an outer compressive layer of the first compressive stress region to form a new first major surface. The outer compressive layer ranges from about 0.05 micrometers to about 5 micrometers. The solution can comprise a first temperature in a range from about 60° C. to about 120° C. The solution can comprise an alkaline solution comprising about 10 wt % or more of a hydroxide-containing base. In aspects, the method can comprise one or more of: attaching an adhesive layer to the new first major surface, attaching a display device to the new first major surface, or disposing a coating over the new first major surface.

Abstract: Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.

Abstract: Described herein are methods of making metallic or elemental silver in the solid state. These methods generally include a step of forming an at least substantially solvent-free solid state reaction mixture that includes a silver-containing compound and an organic acid, followed by heating the reaction mixture at a temperature and for a time effective to form metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.

Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3,and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.

Abstract: Described herein are methods of making metallic or elemental silver. These methods generally include a step of forming a reaction dispersion that includes a silver-containing compound, an organic acid, and a solvent that includes an alcohol, followed by mixing the reaction dispersion for a time and at a temperature effective to form a reaction product that includes metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Abstract: Described herein are methods of recovering silver from solution to produce metallic (i.e., elemental) silver. These methods generally include a step of providing a silver-containing aqueous solution that includes cationic silver species, followed by a step of forming a reaction solution that includes an organic acid, a buffering agent, and the cationic silver species, and a step of generating a reaction product that includes metallic silver by reducing the concentration of the cationic silver species in the reaction solution. Also described herein are metallic or elemental silver produced by these methods.

Abstract: The disclosure relates, in various embodiments, to methods for forming activated carbon comprising (a) providing a feedstock mixture comprising a carbon feedstock, at least one activating agent chosen from alkali metal hydroxides, and at least one additive chosen from fats, oils, fatty acids, fatty acid esters, and polyhydroxylated compounds to form a feedstock mixture; (b) optionally heating the feedstock mixture to a first temperature, and when a step of heating the feedstock mixture to a first temperature is performed, optionally holding the feedstock mixture at the first temperature for a time sufficient to react the at least one activating agent with the at least one additive; (c) optionally milling and/or grinding the feedstock mixture; (d) heating the feedstock mixture to an activation temperature; and (e) holding the feedstock mixture at the activation temperature for a time sufficient to form activated carbon.

Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3, and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Abstract: An apparatus for making an alkali activated carbon, as defined herein, including: a first chamber to combine a carbon and an alkali, free of foaming, to form a billet; a second chamber comprising: a hot zone; and a cold zone; an optional third chamber for washing the cooled billet; and a conveyor that receives carbon and an alkali materials in the first chamber and conveys a mixture of reactants to the second chamber, and then optionally conveys the cooled billet to the optional third chamber. Also disclosed are method of making alkali activated carbon in the disclosed apparatus.

Abstract: Embodiments of a method of making a sorbent comprise providing a monolith having a plurality of internal channels, providing at least one silica coating onto walls of the plurality of internal channels by applying a silica coating solution, and providing at least one chitosan coating on the silica coating by applying a chitosan coating solution.

Abstract: Described herein are methods of making metallic or elemental silver in the solid state. These methods generally include a step of forming an at least substantially solvent-free solid state reaction mixture that includes a silver-containing compound and an organic acid, followed by heating the reaction mixture at a temperature and for a time effective to form metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.

Abstract: Described herein are methods of recovering silver from solution to produce metallic (i.e., elemental) silver. These methods generally include a step of providing a silver-containing aqueous solution that includes cationic silver species, followed by a step of forming a reaction solution that includes an organic acid, a buffering agent, and the cationic silver species, and a step of generating a reaction product that includes metallic silver by reducing the concentration of the cationic silver species in the reaction solution. Also described herein are metallic or elemental silver produced by these methods.

Abstract: Described herein are methods of making metallic or elemental silver. These methods generally include a step of forming a reaction dispersion that includes a silver-containing compound, an organic acid, and a solvent that includes an alcohol, followed by mixing the reaction dispersion for a time and at a temperature effective to form a reaction product that includes metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Abstract: A method of making a sorbent of an activated carbon substrate having a metal sulfide, which may be useful, for example, for removing a contaminant from a fluid stream.

Abstract: A method of conveying a glass substrate utilizing an improved non-contact lifting device. The non-contact lifting device employs the Bernoulli effect to create a pressure differential across the glass substrate. The Bernoulli device of the present invention comprises an increased holding or lifting power, and reduces the opportunity for contact between the device and the glass substrate if the device is tilted with respect the plane of the glass substrate surface.