Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An electromagnetic interference (EMI) shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An EMI shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract: A heatsink including an electromagnetic bandgap structure reduces electromagnetic interference caused by an integrated circuit in an electronic device. One embodiment provides a heatsink having a base with an array of electrically-conductive, thermally-conductive patches spaced apart in two dimensions of a reference plane and having a thickness perpendicular to the reference plane. The patches are interconnected by a plurality of branches. Each branch connects adjacent patches and has a width in the reference plane of less than a width of each adjacent patch. A plurality of thermally conductive cooling fins coupled to a surface of the base and extend normal to the reference plane. The cooling fins may be formed of a thermally-conductive, electrically non-conductive material or may be coupled to the base by a thermally-conductive, electrically non-conductive material.

Abstract: A cable for high speed data communications and methods for manufacturing such cable are disclosed, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The cable also includes conductive shield material wrapped in a rotational direction at a rate along and about the longitudinal axis around the inner conductors and the dielectric layers, including overlapped wraps of the conductive shield material along and about the longitudinal axis, the conductive shield material having a variable width. Transmitting signals on the cable including transmitting a balanced signal characterized by a frequency in the range of 7-9 gigahertz on the cable.

Abstract: A cable for high speed data communications and methods for manufacturing such cable are disclosed, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The cable also includes conductive shield material wrapped in a rotational direction at a rate along and about the longitudinal axis around the inner conductors and the dielectric layers, including overlapped wraps of the conductive shield material along and about the longitudinal axis, the conductive shield material having a variable width. Transmitting signals on the cable including transmitting a balanced signal characterized by a frequency in the range of 7-9 gigahertz on the cable.

Abstract: A cable for high speed data communications and method of manufacturing the cable, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer, the inner conductors and the dielectric layers twisted in a rotational direction at a periodic rate along and about a longitudinal axis and conductive shield material wrapped in the rotational direction at the periodic rate along and about the longitudinal axis around the inner conductors and the dielectric layers, including overlapped wraps at the periodic rate along and about the longitudinal axis. Transmitting signals on the cable including transmitting a balanced signal characterized by a frequency in the range of 7-9 gigahertz on the cable.

Abstract: A cable for high speed data communications and methods for manufacturing such cable are disclosed, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The cable also includes conductive shield material wrapped in a rotational direction at a rate along and about the longitudinal axis around the inner conductors and the dielectric layers, including overlapped wraps of the conductive shield material along and about the longitudinal axis, the conductive shield material having a variable width. Transmitting signals on the cable including transmitting a balanced signal characterized by a frequency in the range of 7-9 gigahertz on the cable.

Abstract: A cable for high speed data communications and method of manufacturing the cable, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer, the inner conductors and the dielectric layers twisted in a rotational direction at a periodic rate along and about a longitudinal axis and conductive shield material wrapped in the rotational direction at the periodic rate along and about the longitudinal axis around the inner conductors and the dielectric layers, including overlapped wraps at the periodic rate along and about the longitudinal axis.

Abstract: A cable for high speed data communications and methods for manufacturing such cable are disclosed, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The cable also includes conductive shield material wrapped in a rotational direction at a rate along and about the longitudinal axis around the inner conductors and the dielectric layers, including overlapped wraps of the conductive shield material along and about the longitudinal axis, the conductive shield material having a variable width. Transmitting signals on the cable including transmitting a balanced signal characterized by a frequency in the range of 7-9 gigahertz on the cable.