Patents by Inventor Samuel R. Peters

Samuel R. Peters has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11919617
    Abstract: Systems and methods are provided for splicing airframe components. One embodiment is a method for assembling an airframe of an aircraft. The method includes forming a first skin of a first circumferential section of fuselage, the first skin including a distal portion comprising a lip and a shoulder, aligning a second skin of a second circumferential section of fuselage with the shoulder such that the lip overlaps the second skin, and affixing the first skin and the second skin together via a circumferential splice.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: March 5, 2024
    Assignee: The Boeing Company
    Inventors: Patrick J. Macko, Byron James Autry, James R. Kendall, Samuel James Knutson, Brian T. Peters, Michael J. Bailey, Matthew S. Stauffer, Steven Wanthal, Santiago M. Mejia, Sara Murphy
  • Patent number: 8330332
    Abstract: An ultrasound transducer (10) comprises an application specific integrated circuit (ASIC) (14), an array of acoustic elements (20), and a pitch independent interposer (12). The ASIC (14) includes a plurality of contact pads (16) on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements (22) of the array (20) are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer (12) features a plurality of conductive elements (26) separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: December 11, 2012
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Johannes W. Weekamp, Samuel R. Peters, Richard E. Davidsen, Wojtek Sudol
  • Publication number: 20100156243
    Abstract: An ultrasound transducer 10 comprises an application specific integrated circuit (ASIC) 14, an array of acoustic elements 20, and a pitch independent interposer 12. The ASIC 14 includes a plurality of contact pads 16 on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements 22 of the array 20 are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer 12 features a plurality of conductive elements 26 separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch.
    Type: Application
    Filed: July 20, 2007
    Publication date: June 24, 2010
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Johannes W. Weekamp, Samuel R. Peters, Richard E. Davidsen, Wojtek Sudol