Abstract: The present disclosure describes an air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card has its own ducting structure affixed thereto to form an integral unit. Cooling air streams are directed simultaneously from individual apertures in the ducting structure upon a respective plurality of integrated circuit package assemblies mounted on the card.

Abstract: The present disclosure describes a connector system for making electrical connections between connectors disposed at opposite extremities of a logic board to conductors in a respective pair of parallel, spaced-apart backplanes. Movable pin headers containing respective pluralities of pins are disposed on the outer surfaces of the backplanes. The pin headers are capable of assuming either a retracted or an extended position. In the former, the pins offer no interference to the insertion or removal of the logic board between the backplanes. In the latter, the pins traverse both feed-through holes in the backplanes and feed-through socket affixed to the opposed interior surfaces of the respective backplanes to electrically engage the connectors of the logic board, thereby completing circuit paths between the respective backplanes and the logic board.

Abstract: The present disclosure describes an air sampling system which is particularly effective in detecting minute quantities of smoke caused by electrical short circuits in equipment housed in an air cooled cabinet. More, specifically, the system is useful where large number of rack-mounted printed circuit cards are employed. The system employs air sampling cylinders mounted in proximity to the cards, and through the establishment of a pressure differential, causes an air sample to be drawn into the tubes and through a detector box which includes a smoke detection unit. The presence of smoke is conveyed to a control box which responds by removing electrical power to the cards, thereby averting further damage to the cards or surrounding structures.

Abstract: The present disclosure describes a heat exchange element for attachment to the external surface of a package containing an integrated circuit chip or die. The element has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present element is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically the element is an integral structure comprised of a generally helical wire form with substantially elliptic turns wrapped around a metallic plate in symmetrical fashion and in intimate contact with opposed edges of the latter. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the element is attached.

Abstract: The present disclosure describes a heat exchange device for attachment to the external surface of a package containing an integrated circuit chip or die. The device has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present device is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically, the device is an integral structure comprised of a generally helical wire form affixed to a metallic frame-like member. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the device is attached.

Abstract: A tool is described for facilitating the cutting of printed circuit board wires necessitated by changes in the circuit design or the occurrence of electrical faults. The tool is particularly useful with circuit boards having high density wiring, where it virtually eliminates damage to printed wires adjacent to those being severed. Comprised of a guide pin centrally disposed with respect to an annular cutting edge, the tool uses the former for registration with the component and via holes in the circuit board, and the latter, to sever the printed wires from the electrically conductive pads surrounding the holes. The depth of the cut is carefully controlled by the tool and may be chosen to eliminate electrical faults lying below the surface in a multilayer board.

Abstract: A device is described for facilitating the application of an identifying label to a specific location on the surface of an integrated circuit package. In performing its function, the device permits an operator to lift a self-adhering label containing the desired indicia from its backing card while visually aligning it in the device. The operator then places one end of the integrated circuit package into the device, thereby effectively aligning the label with a desired location on the package surface so that it may be transferred thereto. The device finds particular application in an actual operative high density packaging system wherein the adjacent surfaces of a pair of integrated circuit packages are visible only through a narrow slot in a package hold-down member. Labels, such as those placed on generic PROM packages by operators immediately after programming, are thus precisely located so that their type designation can be seen through the aforementioned slot.

Abstract: A latch assembly is described for applying a high clamping force to an electronic component installed in a suitable connector. The latch assembly insures reliable electrical connection between the component circuit leads and the connector contact elements, as well as a good ground connection between the component and a cooling frame which also serves as the system ground. The present invention finds particular application in the clamping of an interconnect cable assembly. The latter includes flat or ribbon-type cables installed in a suitable housing and adapted to be mounted in a connector. The latch is universal in that it is effective with a single full cable assembly, a pair of split assemblies or a single split assembly. Moreover the latch may be easily applied and removed without the use of tools, thereby facilitating system operations which frequently involve the removal, substitution or interchange of cable assemblies.